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SEL6410G Dataheets PDF



Part Number SEL6410G
Manufacturers Sanken
Logo Sanken
Description LED
Datasheet SEL6410G DatasheetSEL6410G Datasheet (PDF)

Round-type contact mount LEDs (for automatic insertion) sSEL6010 series (Standard type) SEL6210R Outline drawing A sSEL6014 series (Wide viewing angle) SEL6414E Outline drawing B 3.5 1.0min Cathode 0.8±0.2 0.8±0.2 23.0min 5.5±0.5 (1.7) 3.5±0.1 ø3.1±0.1 3.5 1.0min Cathode (P.2.54) 23.0min 4.5±0.5 (1.6) 2.5±0.1 (P.2.54) 4.0±0.2 4.0±0.2 ø3.5 4.4 0.45±0.1 0.65max 0.45±0.1 0.4±0.1 Resin heap 0.8max 0.4±0.1 0.65max Resin heap 0.8max sSEL6015 series (Narrow viewing angle) Absolut.

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Round-type contact mount LEDs (for automatic insertion) sSEL6010 series (Standard type) SEL6210R Outline drawing A sSEL6014 series (Wide viewing angle) SEL6414E Outline drawing B 3.5 1.0min Cathode 0.8±0.2 0.8±0.2 23.0min 5.5±0.5 (1.7) 3.5±0.1 ø3.1±0.1 3.5 1.0min Cathode (P.2.54) 23.0min 4.5±0.5 (1.6) 2.5±0.1 (P.2.54) 4.0±0.2 4.0±0.2 ø3.5 4.4 0.45±0.1 0.65max 0.45±0.1 0.4±0.1 Resin heap 0.8max 0.4±0.1 0.65max Resin heap 0.8max sSEL6015 series (Narrow viewing angle) Absolute maximum ratings (Ta=25°C) Symbol Unit Ratings IF mA 30 IFP mA 100 VR V 3 Top °C –30 to +85 Tstg °C –30 to +100 qSEL6000 series LEDs packaged on tapes can withstand shocks caused by insertion machines; Thus, they can be contact-mounted automatically on circuit boards. Recommended dimensions of insertion holes on printed circuit boards ø0.9∼1.0 SEL6915A Outline drawing C 3.5 ±0.2 1.0min Cathode (P.2.54) 0.8 4.0±0.2 ø3.1 ±0.1 Resin burr 0.3max 23.0min (1.7) 3.5±0.1 0.45±0.1 0.4±0.1 0.65max Resin heap 0.8max Cathode mark sExternal dimensions: Unit: mm Tolerance: ±0.3 2.54mm Viewing angle SEL6010 series 0° 30° 60° 30° 60° 60° 30° SEL6014 series 0° 30° 60° 60° 30° SEL6015 series 0° 30° 60° 90° 100% 50 0 50 90° 100% 90° 100% 50 0 50 90° 100% 90° 100% 50 0 50 90° 100% Viewing angle of a non-diffused lens Viewing angle of a non-diffused lens Viewing angle of a non-diffused lens 0° 30° 60° 30° 60° 90° 100% 50 0 50 90° 100% Viewing angle of a diffused lens 18 4.4 4.4 Type No. Display form (ø: mm) q3.1 q3.1 q3.1 q3.1 q3.1 q3.1 q3.1 q3.1 q3.1 q3.1 q3.1 q3.1 q3.5 q3.5 q3.5 q3.5 q3.5 q3.1 q3.1 q3.1 q3.1 q3.1 Electro-optical characteristics (Ta=25°C) Type of lens Emitting color typ Red tinted, diffused High intensity red Red tinted, non-diffused Green tinted, diffused Green Green tinted, non-diffused Green tinted, diffused Pure green Un-tinted, non-diffused Yellow tinted, diffused Yellow Yellow tinted, non-diffused Orange tinted, diffused Amber Orange tinted, non-diffused Orange tinted, diffused Orange Orange tinted, non-diffused Red tinted, non-diffused High intensity red Green tinted, non-diffused Green Un-tinted, non-diffused Pure green Orange tinted, non-diffused Amber Orange tinted, non-diffused Orange Red tinted, non-diffused High intensity red Green tinted, non-diffused Green Un-tinted, non-diffused Pure green Orange tinted, non-diffused Amber Orange tinted, non-diffused Orange 1.9 VF (V) IR IV Condition (µA) Condition (mcd) Condition IF VR IF max (mA) max typ (mA) (V) 12 25 15 20 45 5 16 2.5 10 50 3 5 15 4 10 10 6.5 14 10 12 20 6 2.5 10 50 3 5 10 5 30 50 18 20 2.5 10 50 3 30 40 λp ∆λ Outline drawing (nm) typ 630 560 20 555 A SEL6210R SEL6210S SEL6410G SEL6410E SEL6510G SEL6510C SEL6710Y SEL6710K SEL6810D SEL6810A SEL6910D SEL6910A SEL6214S SEL6414E SEL6514C SEL6814A SEL6914A SEL6215S SEL6415E SEL6515C SEL6815A SEL6915A 35 2.0 570 610 587 630 560 555 610 587 630 560 555 610 587 40 35 33 35 20 35 33 35 20 35 33 C B 1.9 1.9 2.0 1.9 1.9 2.0 1.9 sUsing contact mount LEDs packaged on tapes 1. Printed circuit board qOne-side printed circuit board is recommended. qIf there are several SMD parts on the same printed circuit board, insert the LEDs after the adhesive for other SMD parts hardened. qUse low insertion pusher pressure, as much as possible. qCut and clinch: Panasert T pattern is recommended. For N pattern, make the clinching angle of the LED’s anode as small as possible. qPreheating must be less than 90°C (temperature on printed circuit board’s bottom surface) for no more than two minutes qSolder dipping must be made at a temperature of 250°C for no more than 3 seconds. 2. Insertion conditions 3. Soldering conditions 19 .


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