Package outline
PDF: 1999 Apr 16
Philips Semiconductors
Package outline
Plastic single-ended package; heatsink mounted; 1 moumting ho...
Description
PDF: 1999 Apr 16
Philips Semiconductors
Package outline
Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220
SOT263
E P
A A1 q
D1
D
mounting base
L3 m L L2
L1 Q
1
e b
5
w M c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 4.5 4.1 A1 1.39 1.27 b 0.9 0.7 c 0.7 0.4 D 15.8 15.2 D1 6.4 5.9 E 10.3 9.7 e 1.7 L 15.0 13.5 L1
(1)
L2
(2)
L3 max. 3.5
(3)
m 0.8 0.6
P 3.8 3.6
q 3.0 2.7
Q 2.6 2.2
w 0.4
2.4 1.6
0.5
Notes 1. Terminal dimensions are uncontrolled in this zone. 2. Positional accuracy of the terminals is controlled in this zone. 3. Terminals in this zone are not tinned. OUTLINE VERSION SOT263 REFERENCES IEC JEDEC 5-lead TO-220 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-11
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