Package outline
PDF: 2003 Feb 18
Philips Semiconductors
Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT2...
Description
PDF: 2003 Feb 18
Philips Semiconductors
Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH w M (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001 JEITA SC-501-14 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
...
Similar Datasheet