Document
Philips Semiconductors
Package outline
Plastic surface mounted package; 3 leads
SOT416
D
B
E
A
X
v M A
HE
3
Q
A
1
e1 e bp
2
w M B
A1 c
Lp detail X
0
0.5 scale
1 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.95 0.60 A1 max 0.1 bp 0.30 0.15 c 0.25 0.10 D 1.8 1.4 E 0.9 0.7 e 1 e1 0.5 HE 1.75 1.45 Lp 0.45 0.15 Q 0.23 0.13 v 0.2 w 0.2
OUTLINE VERSION SOT416
REFERENCES IEC JEDEC JEITA SC-75
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 04-11-04
SOT416
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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4 November 2004
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