Package outline
PDF: 2003 Apr 07
Philips Semiconductors
Package outline
HTSSOP20: plastic thermal enhanced thin shrink small outline ...
Description
PDF: 2003 Apr 07
Philips Semiconductors
Package outline
HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad
SOT527-1
D
E
A
X
c y exposed die pad side HE v M A
Z
Dh
20
11
pin 1 index
Eh
A2 A1
(A 3)
A θ
Lp L
1
e bp
10
w M detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.20 0.09 D(1) 6.6 6.4 Dh 4.3 4.1 E(2) 4.5 4.3 Eh 3.1 2.9 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 v 0.2 w 0.13 y 0.1 Z(1) 0.5 0.2 θ 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT527-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-02-18 03-04-07
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