IRFN5210

IRFN5210 MECHANICAL DATA Dimensions in mm (inches) 0 .8 9 (0 .0 3 5 ) m in . 3 .7 0 (0 .1 4 6 ) 3 .7 0 (0 .1 4 6 ) 3 .4 1 (0 .1 3 4 ) 3 .4 1 (0 .1 3 4 ) 4 .1 4 (0 .1 6 3 ) 3 .8 4 (0 .1 5 1 ) P–CHANNEL POWER MOSFET 3 .6 0 (0 .1 4 2 ) M a x . 1 3 0 .7 6 (0 .0 3 0 ) m in . VDSS ID(cont) RDS(on) FEATURES -100V -31A 0.060Ω 1 0 .6 9 (0 .4 2 1 ) 1 0 .3 9 (0 .4 0 9 ) 2 1 6 .0 2 (0 .6 3 1 ) 1 5 .7 3 (0 .6 1 9 ) HERMETICALLY SEALED SURFACE MOUNT PACKAGE SMALL FOOTPRINT – EFFICIENT USE OF PCB SPACE. 9 .6 9 .3 1 1 .5 1 1 .2 7 (0 8 (0 8 (0 8 (0 .3 8 .3 6 .4 5 .4 4 1 ) 9 ) 6 ) 4 ) 0 .5 0 (0 .0 2 0 ) 0 .2 6 (0 .0 1 0 ) SIMPLE DRIVE REQUIREMENTS LIGHTWEIGHT HIGH PACKING DENSITIES SMD 1 PACKAGE (TO-276AB) Pad 1 – Source Pad 2 – Drain Pad 3 – Gate Note: IRF5210SMD also available with pins 1 and 3 reversed. ±20V ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated) VGS ID ID IDM PD EAS dv/dt TJ , Tstg TL RθJC Gate – Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current 1 Power Dissipation @ Tcase = 25°C Linear Derating Factor Single Pulse Avalanche Energy Peak Diode Recovery 3 Operating and Storage Temperature Range Package Mounting Surface Temperature (for 5 sec) Thermal Resistance Junction to Case 2 (VGS = 0 , Tcase = 25°C) (VGS = 0 , Tcase = 100°C) -31A -19A -124A 125W 1.0W/°C 340mJ 4.0V/ns –55 to 150°C 300°C 1.0°C/W Notes 1) Pulse Test: Pulse Width ≤ 300ms, δ ≤ 2% 2) @ VDD = -25V , L = 1.9mH , Peak IAS = -19A , VGS...