Advanced Boot Block Flash Memory
Intel® Advanced+ Boot Block Flash Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
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Description
Intel® Advanced+ Boot Block Flash Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
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Flexible SmartVoltage Technology — 2.7 V– 3.6 V read/program/erase — 12 V for fast production programming 1.65 V to 2.5 V or 2.7 V to 3.6 V I/O Option — Reduces overall system power High Performance — 2.7 V– 3.6 V: 70 ns max access time Optimized Architecture for Code Plus Data Storage — Eight 4 Kword blocks, top or bottom parameter boot — Up to 127 x 32 Kword blocks — Fast program suspend capability — Fast erase suspend capability Flexible Block Locking — Lock/unlock any block — Full protection on power-up — Write Protect(WP#) pin for hardware block protection Low Power Consumption — 9 mA typical read — 7 uA typical standby with Automatic Power Savings feature Extended Temperature Operation — -40 °C to +85 °C
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128-bit Protection Register — 64 bit unique device identifier — 64 bit user programmable OTP cells Extended Cycling Capability — Minimum 100,000 block erase cycles Software — Intel® Flash Data Integrator — Supports top or bottom boot storage, streaming data (for example, voice) — Intel Basic Command Set — Common Flash Interface Standard Surface Mount Packaging — 48-Ball µBGA*/VFBGA — 64-Ball Easy BGA packages — 48-TSOP package ETOX™ VIII (0.13 µm) Flash Technology — 8, 16, 32 Mbit ETOX™ VII (0.18 µm) Flash Technology — 16, 32, 64 Mbit ETOX™ VI (0.25 µm) Flash Technology — 8, 16 and 32 Mbit
The Intel® Advanced+ ...
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