Thermal Data
Thermal Data
DIP 40
40 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 ...
Description
Thermal Data
DIP 40
40 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 µm
molding compound
3.8 mm
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time
September 1999
1/2
Thermal Data
Dip 40
Rth(j-a) (ºC/W) 65
1)
60
die size 35000 sq. mils dissipating area 2000 sq. mils 2 s 1 Oz. board
55
50 0 0.5 1 1.5 dissipated power ( Watt ) 2 2.5 3
Zth( ºC/W)
2)
10
die size 35000 sq. mils dissipating area 2000 sq. mils 2s 1Oz. board 2 w single square pulse
0.001
0.01
0.1
1
Time (s)
10
100
1,000
2/2
...
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