Chip LED Lamp
Semiconductor
SW1314E-V
Chip LED Lamp
Features
• • • • 1.6mm(L)×0.8mm small size surface mount type Thin package of 0....
Description
Semiconductor
SW1314E-V
Chip LED Lamp
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.4mm(H) thickness Transparent clear lens optic Low power consumption type chip LED
E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5kΩ)
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit :
mm
KLW-3000-000
1
Absolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature
2 1
SW1314E-V
Ratings
80 20 50 4 -25∼80 -30∼100
Symbol
PD IF IFP VR Topr Tstg
Unit
mW mA mA V ℃ ℃
240℃ for 5 seconds * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching)
Electrical Characteristics
Characteristic
Forward Voltage
Symbol
VF
Test Condition
IF= 5mA
Min
-
Typ
3.1
Max
3.4
Unit
V
*3Luminous Intensity
IV X Y
IF= 5mA
15 0.160 0.120 -
40 ±65 ±70
65 0.230 0.230 -
mcd deg
*4Chromaticity Coordinates
IF= 5mA
*5Half Angle
θ1/2
X Y
IF= 5mA
KLW-3000-000
2
SW1314E-V
*3. Forward Voltage Maximum tolerance for ±0.1V *4. Luminous Intensity Maximum tolerance for each Grade Classification limit is ±18% (The test result of IF=5mA is only for reference) *5. CIE Coordinates bin limits will have ±0.02 tolerance *6. θ1/2 is the off-ax...
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