WLAN SiP. BGW211 Datasheet

BGW211 SiP. Datasheet pdf. Equivalent

Part BGW211
Description Low Power WLAN SiP
Feature BGW211 Low-power WLAN SiP Optimized for use in battery-powered handheld devices, the BGW211 System-i.
Manufacture Philips
Datasheet
Download BGW211 Datasheet




BGW211
BGW211 Low-power
WLAN SiP
Complete, single-package 802.11g
solution for mobile phones and
portable consumer devices
Optimized for use in battery-powered handheld devices,
the BGW211 System-in-a-Package (SiP) delivers complete
802.11g functionality with the industry’s lowest standby and
operating power consumption. It requires no external com-
ponents and uses only 150 mm2 of board area for the total
802.11g solution.
Semiconductors
The BGW211 is Philips’ third-generation System-in-a-Package (SiP)
solution for low-power 802.11 Wireless LAN (WLAN). Supporting
complete 802.11g functionality, it enables consumers to access data and
multimedia content through WLAN networks up to five times faster
than current 802.11b products without compromising battery life.
The BGW211 delivers industry-leading standby and operating power in a
package that measures only 150 mm2 and requires no external compo-
nents for operation. Extensive support for Quality of Service (QoS) and
coexistence with Bluetooth wireless make it robust enough for very
demanding portable applications.
Key features
Advanced, single-package WLAN 802.11g optimized for mobile
handheld devices
No RF-critical design required
Low total cost of ownership
Lowest-power consumption in standby (< 2 mW) and operating
modes (PA, RF, baseband/MAC)
Ultra-small form factor
Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
No external components required
Ideal mobile architecture
No WLAN related processor load in all operating modes
Integrated ARM7 controller with associated memories
Comprehensive QoS
All mandatory 802.11e features, plus DLS, Block ACK, APSD
Optimized for real-time applications with minimal system power
consumption
Co-exists with Bluetooth®
Seamless upgrade path from BGW200 802.11b SiP
Complete software drivers, utilities, and diagnostic tools
The latest SiP technology from Philips allows all of the components
needed for a complete 802.11g WLAN subsystem to be contained in
a single, low-profile HVQFN package that measures only 10 x 15 x 1.3
mm. The SiP contains the industry’s first 90-nm CMOS 802.11g base-
band/MAC and a silicon-germanium BiCMOS radio transceiver. Unlike
other “one-chip” solutions, which require the use of external receive
LNAs, transmit power amplifiers, and/or additional components, the
BGW211 SiP requires no external components to meet the range and
throughput performance requirements of mobile handsets and network
operators.
By providing complete system functionality in a single package, the SiP
format delivers quicker design cycles, reduces risk, simplifies manufac-
turing, and reduces the bill of materials. Also, because the SiP offers
fully tested functionality, it lets the customer’s development team focus
their energy on innovative product design instead of the complex issues
related to RF layout.



BGW211
BGW211 Low-power WLAN SiP
Complete, single-package 802.11g solution for mobile phones & portable consumer devices
Semiconductors
Applications
• Smartphones, cellular phones, VoIP wireless phones
• PDAs, handheld computing devices, WLAN adapter cards (Secure
Digital)
• Portable audio/video devices, MP3 players
• Other handhelds and electronic devices for wireless digital, audio,
multimedia, and telephony
less power in 802.11b mode than its BGW200 predecessor and in
802.11g mode provides the lowest system power consumption avail-
able while delivering –73 dBm receiver sensitivity at 54 Mbps and 15
dBm transmit output power at the antenna port. Receiver power
consumption in 802.11b mode is 300 mW and in 802.11g mode is
400 mW. Transmit power at 15 dBm is 550 mW for 802.11b and 600
mW for 802.11g.
Industry’s lowest power consumption
The BGW211 builds on an established position as the industry’s
lowest standby power mobile Wi-Fi solution to significantly reduce
receive and transmit power during operation. It consumes 30%
Several features combine to minimize power consumption. There is
an integrated ARM7 processor, 1.25 Mbytes of SRAM, 256 Kbytes of
ROM, optimized host interfaces (SDIO/SPI), and integrated power
management hardware/software algorithms. The result is the lowest
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BGW211 functional block diagram
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