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AN5522 Dataheets PDF



Part Number AN5522
Manufacturers ETC
Logo ETC
Description Vertical Deflection
Datasheet AN5522 DatasheetAN5522 Datasheet (PDF)

TDA8172 TV VERTICAL DEFLECTION OUTPUT CIRCUIT FEATURES s Power Amplifier s Flyback Generator s Thermal Protection DESCRIPTION The TDA8172 is a monolithic integrated circuit in HeptawattTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in color and black & white television as well as in monitors and displays. PIN CONNECTION (top view) HEPTAWATT (Plastic Package) ORDER CODE: TDA8172 BLOCK DIAGRAM October 2003 1/7 1 .

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TDA8172 TV VERTICAL DEFLECTION OUTPUT CIRCUIT FEATURES s Power Amplifier s Flyback Generator s Thermal Protection DESCRIPTION The TDA8172 is a monolithic integrated circuit in HeptawattTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in color and black & white television as well as in monitors and displays. PIN CONNECTION (top view) HEPTAWATT (Plastic Package) ORDER CODE: TDA8172 BLOCK DIAGRAM October 2003 1/7 1 TDA8172 1 ABSOLUTE MAXIMUM RATINGS Symbol VS V5, V6 V3 V1, V7 I0 I0 I0 I3 I3 I3 Ptot Tstg, Tj Parameter Supply Voltage (pin 2) Flyback Peak Voltage Voltage at Pin 3 (see Note 1) Amplifier Input Voltage Output Peak Current (non repetitive, t = 2ms) Output Peak Current at f = 50 to 200 Hz, t ≤ 10µs Output Peak Current at f = 50 to 200 Hz, t > 10µs Pin 3 DC Current at V5 < V2 Pin 3 Flyback Current at f = 50 to 200 Hz, tfly ≤ 1.5ms Pin 3 Sink Current at f = 50 to 200 Hz, t ≤ 10µs Total Power Dissipation at Tcase = 90 °C Storage and Junction Temperature Note 1:This occurs during the first part of flyback pulse Value 35 60 VS + 3 VS - 0.5 2.5 ±5 2 100 ±1.5 5 20 -40, +150 Unit V V V V A A A mA A A W °C 2 THERMAL DATA Symbol Rth(j-c) Parameter Thermal Resistance Junction-case Value 3 Unit °C/W 3 ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25°C unless otherwise specified) Symbol Parameter Test Conditions I2 Pin 2 Quiescent Current I6 Pin 6 Quiescent Current I1 Amplifier Input Bias Current V3L Pin 3 Saturation Voltage to GND V5 Quiescent Output Voltage V5L Output Saturation Voltage to GND I3 = 0, I5 = 0 I3 = 0, I5 = 0 V1 = 1 V, V7 = 2 V V1 = 2 V, V7 = 1 V I3 = 20 mA VS = 35V, Ra = 39 kΩ I5 = 1.2 A I5 = 0.7 A V5H Output Saturation Voltage to Supply - I5 = 1.2 A - I5 = 0.7 A Tj Junction Temperature for Thermal Shutdown Min. Typ. Max. Unit Fig. 8 16 mA 1 16 36 mA 1 - 0.1 - 1 µA 1 - 0.1 - 1 µA 1 1 1.5 V 3 18 V4 1 1.4 V 3 0.7 1 V 3 1.6 2.2 V 2 1.3 1.8 V 2 140 °C 2/7 1 Figure 1. Measurement of I1, I2, I6 Figure 2. Measurement of V5H TDA8172 I2 2 I6 6 5 TDA8172 1 7 4 V7 +VS 10kΩ S a b I1 1V 2 6 1 TDA8172 5 1V 7 4 V7 +VS V5H -I5 S1: (a) I2 and I6 ; (b) I1 Figure 3. Measurement of V3L, V5L Figure 4. Measurement of V5 +VS I3 or I5 2 6 S1 a 3b 1 TDA8172 5 7 4 V7 V3L V5L 2 6 12kΩ 1 TDA8172 5 2V 7 V7 4 Ra 5.6kΩ +VS V5 S: (a) V3L ; (b) V5L 3/7 TDA8172 Figure 5. AC test circuit 1N4001 VS C1 0.1µF C2 470µF D1 C3 220µF tfly 2 63 GND t0 VREF 7 Vi R1 1 10kΩ RT1 4.7kΩ TDA8172 4 V7 Ly 5 C4 0.22µF to Ly 24.6mH R7 1.5Ω R6 330Ω Ry 9.6Ω IN R2 5.6kΩ R3 12kΩ C6 4.7µF R4 8.2kΩ C5 2200µF R5Ly *Recommended for VREF filtering R5 8.2Ω t0 4/7 TDA8172 4 MOUNTING INSTRUCTIONS The power dissipated in the circuit is removed by adding an external heatsink. With the HEPTAWATT™ package, the heatsink is simply attached with a screw or a compression spring (clip). A layer of silicon grease inserted between heatsink and package optimizes thermal contact ; no electrical isolation is needed between the two surfaces since the tab is connected to Pin 4 which is ground. Figure 6. Mounting examples 5/7 M1 D1 D E TDA8172 5 PACKAGE MECHANICAL DATA 9 PINS - plastic heptawatt L L1 A C L2 L5 L3 M F1 H2 F G G1 G2 H3 Dia. L7 L6 Dimensions A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia. Min. 2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05 2.6 15.1 6 3.65 Millimeters Typ. 2.54 5.08 7.62 16.97 14.92 21.54 22.62 2.8 5.08 Max. 4.8 1.37 2.8 1.35 0.55 0.8 0.9 2.67 5.21 7.8 10.4 10.4 3 15.8 6.6 3.85 Min. 0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396 0.102 0.594 0.236 0.144 Inches Typ. 0.100 0.200 0.300 0.668 0.587 0.848 0.891 0.110 0.200 Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409 0.118 0.622 0.260 0.152 6/7 TDA8172 I Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - U.


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