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40106 Dataheets PDF



Part Number 40106
Manufacturers ETC
Logo ETC
Description CD40106B
Datasheet 40106 Datasheet40106 Datasheet (PDF)

www.DataSheet4U.com Data sheet acquired from Harris Semiconductor SCHS097D – Revised September 2003 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.D.

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www.DataSheet4U.com Data sheet acquired from Harris Semiconductor SCHS097D – Revised September 2003 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.ti.com PACKAGE OPTION ADDENDUM 10-Mar-2005 PACKAGING INFORMATION Orderable Device CD40106BE CD40106BF CD40106BF3A CD40106BM CD40106BM96 CD40106BMT CD40106BNSR CD40106BPW CD40106BPWR (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type PDIP CDIP CDIP SOIC SOIC SOIC SO TSSOP TSSOP Package Drawing N J J D D D NS PW PW Pins Package Eco Plan (2) Qty 14 14 14 14 14 14 14 14 14 25 1 1 50 2500 250 2000 90 2000 Pb-Free (RoHS) None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Lead/Ball Finish CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) 14 PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,65 14 8 0,30 0,19 0,10 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0°– 8° 0,75 0,50 Seating Plane 1,20 MAX 0,15 0,05 0,10 PINS ** DIM A MAX 8 14 16 20 24 28 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 www.DataSheet4U.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and sho.


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