KBE00F005A-D411

KBE00F005A-D411 MCP MEMORY MCP Specification 512Mb NAND*2 + 256Mb Mobile SDRAM*2 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure couldresult in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. * Samsung Electronics reserves the right to change products or specification without notice. 1 Revision 1.0 June 2005 KBE00F005A-D411 Document Title MCP MEMORY Multi-Chip Package MEMORY 512M Bit(64Mx8) Nand Flash*2 / 256M Bit (2Mx32x4Banks) Mobile SDRAM*2 Revision History Revision No. History 0.0 Initial issue. - 1Gb NAND Flash DDP B-Die _ Ver 0.1 - 512Mb Mobile SDRAM DDP F-Die _ Ver 1.0 - Changed operating temperature : page 3 .... Ver 0.2 - Changed flow chart : page 16 - Finalize Draft Date April 06, 2005 Remark Preliminary 1.0 June 21, 2...