N-CHANNEL IGBT
STGB3NB60SD
N-CHANNEL 3A - 600V D2PAK Power MESH™ IGBT
TYPE STGB3NB60SD
s
VCES 600 V
VCE(sat) <1.5 V
Ic 3A
s s s s s...
Description
STGB3NB60SD
N-CHANNEL 3A - 600V D2PAK Power MESH™ IGBT
TYPE STGB3NB60SD
s
VCES 600 V
VCE(sat) <1.5 V
Ic 3A
s s s s s
HIGH INPUT IMPEDANCE (VOLTAGE DRIVEN) VERY LOW ON-VOLTAGE DROP (Vcesat) HIGH CURRENT CAPABILITY OFF LOSSES INCLUDE TAIL CURRENT INTEGRATED FREEWHEELING DIODE SURFACE-MOUNTING D2PAK (TO-263) POWER PACKAGE IN TAPE & REEL (SUFFIX “T4”)
3 1
D2PAK TO-263 (suffix“T4”)
DESCRIPTION
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding perfomances. The suffix “S” identifies a family optimized to achieve minimum on-voltage drop for low frequency applications (<1kHz).
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS s GAS DISCHARGE LAMP s STATIC RELAYS s MOTOR CONTROL
ABSOLUTE MAXIMUM RATINGS
Symbol VCES VGE IC IC ICM() Ptot Tstg Tj Parameter Collector-Emitter Voltage (VGS = 0) Gate-Emitter Voltage Collector Current (continuos) at Tc=25°C Collector Current (continuos)at Tc=100°C Collector Current (pulsed) Total Dissipation at Tc = 25°C Derating Factor Storage Temperature Max. Operating Junction Temperature Value 600 ± 20 6 3 25 70 0.46 –60 to 175 175 Unit V V A A A W W/°C °C °C
()Pulse width limited by safe operating area.
November 2000
1/8
STGB3NB60SD
THERMAL DATA
Rthj-case Rthj-amb Rthc-sink Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink Max Max Typ 2.14 62.5 0.5 °C/W °C/W °C/W
ELECTRICAL CHA...
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