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MPX5010 Dataheets PDF



Part Number MPX5010
Manufacturers Motorola
Logo Motorola
Description INTEGRATED PRESSURE SENSOR
Datasheet MPX5010 DatasheetMPX5010 Datasheet (PDF)

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX5010/D MPX5010 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX5010 series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques,.

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MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX5010/D MPX5010 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX5010 series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • 5.0% Maximum Error over 0° to 85°C • Ideally Suited for Microprocessor or Microcontroller–Based Systems • Patented Silicon Shear Stress Strain Gauge • Durable Epoxy Unibody Element • Temperature Compensated over BASIC CHIP CARRIER ELEMENT CASE 867–08, STYLE 1 SERIES INTEGRATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) 0.2 to 4.7 V OUTPUT *40° to +125°C VS 3 X–ducer SENSING ELEMENT THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 2 GND GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY 1 Vout DIFFERENTIAL PORT OPTION CASE 867C–05, STYLE 1 PINS 4, 5 AND 6 ARE NO CONNECTS PIN NUMBER 1 2 3 Vout Gnd VS 4 5 6 N/C N/C N/C Figure 1. Fully Integrated Pressure Sensor Schematic MAXIMUM RATINGS(1) Parametrics Overpressure(2) (P1 > P2) Burst Pressure(2) (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Pburst Tstg TA Value 75 100 – 40 to +125 – 40 to +125 Unit kPa kPa °C °C NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the Lead. 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Senseon and X–ducer are trademarks of Motorola, Inc. REV 2 Motorola Sensor Device Data © Motorola, Inc. 1997 1 MPX5010 SERIES OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm–Up Time(8) Offset Stability(9) (0 to 85°C) (0 to 85°C) (0 to 85°C) (0 to 85°C) Symbol POP VS Io Voff VFSO VFSS — V/P tR IO+ — — Min 0 4.75 — 0 4.475 — — — — — — — Typ — 5.0 7.0 0.2 4.7 4.5 — 450 1.0 0.1 20 ± 0.5 Max 10 5.25 10 0.425 4.925 — ± 5.0 — — — — — Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS MECHANICAL CHARACTERISTICS Characteristic Weight, Basic Element (Case 867) Common Mode Line Pressure(10) Symbol — — Min — — Typ 4.0 — Max — 690 Unit Grams kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface. 2 Motorola Sensor Device Data MPX5010 SERIES ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the d.


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