Document
STPS15H100C
High voltage power Schottky rectifier
A1 K
A2
K
K
A1 A2
A1 A2
DPAK
Features
Negligible switching losses Low leakage current Good trade off between leakage current and
forward voltage drop Low thermal resistance Avalanche capability specified ECOPACK®2 compliant component for DPAK
on demand
Datasheet - production data
Description
Dual center tab Schottky rectifier suited for switched mode power supply and high frequency DC to DC converters.
Packaged in DPAK, this device is intended for use in high frequency inverters.
Table 1. Device summary
Symbol
Value
IF(AV) VRRM
Tj VF (typ)
2 x 7.5 A 100 V 175 °C 0.62 V
December 2015
This is information on a product in full production.
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Characteristics
1
Characteristics
STPS15H100C
Table 2. Absolute ratings (limiting values per diode at 25 °C unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM IF(RMS)
IF(AV)
Repetitive peak reverse voltage
Forward rms current
Average forward current, δ = 0.5, square
wave
Tc = 135 °C(1)
Per diode Per device
IFSM PARM
Surge non repetitive forward current Repetitive peak avalanche power
tp = 10 ms sinusoidal tp = 10 µs, Tj = 125 °C
Tstg Storage temperature range
Tj
Maximum operating junction temperature(2)
1. Value based on Rth(j-c) max (per diode)
2.
d----P-----t--o----t dTj
R-----t--h-----1--j---–----a----
condition to avoid thermal runaway for a diode on its own heatsink
100
V
10
A
7.5
A
15
75
A
475
W
-65 to +175 °C
175
°C
Table 3. Thermal resistance
Symbol
Parameter
Value
Unit
Rth(j-c) Rth(c)
Junction to case Coupling
Per diode Total
4
2.4
°C/W
0.7
When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Symbol
Table 4. Static electrical characteristics (per diode)
Parameter
Test Conditions
Min. Typ. Max. Unit
IR(1) Reverse leakage current
VF(2) Forward voltage drop
1. tp = 5 ms, < 2% 2. tp = 380 µs, < 2%
Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C
VR = VRRM
IF = 7.5 A IF = 7.5 A IF = 12 A IF = 12 A IF = 15 A IF = 15 A
3
µA
1.3
4
mA
0.8
0.62 0.67
0.85 V
0.68 0.73
0.89
0.71 0.76
To evaluate the conduction losses use the following equation: P = 0.58 x IF(AV) + 0.012 IF2(RMS)
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STPS15H100C
Characteristics
Figure 1. Conduction losses versus average current (per diode)
Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode)
PF(av)(W) 7
IF(av)(A) 9
6
δ = 0.5
8
Rth(j-a)= Rth(j-c)
5
δ = 0.2
δ = 0.1 4
δ = 0.05
7
6 δ=1
5
3
4
3
Rth (j - a) = 70 °C/W
2
T
2
T
1
IF(av)(A)
1
δ = tp/T tp
δ = tp/T tp
0
0
0
1
2
3
4
5
6
7
8
9
0
25
50
Tamb(°C)
75
100
125
150
175
Figure 3. Normalized avalanche power derating versus pulse duration at Tj = 125 °C
PARM (t p ) 1 PARM(10 µs)
0.1
0.01
0.001 1
t p(µs)
10
100
1000
Figure 4. Relative variation of thermal impedance junction to case versus pulse
duration
Zth(j-c)/Rth(j-c) 1.0 0.9
0.8 0.7
δ = 0.5 0.6 0.5 0.4 δ = 0.2 0.3 δ = 0.1 0.2
Single pulse
0.1 0.0
1.E-03
1.E-02
tp(s)
T
1.E-01
δ =tp/T
tp 1.E+00
Figure 5. Reverse leakage current versus reverse voltage applied
(typical values, per diode)
Figure 6. Junction capacitance versus reverse voltage applied
(typical values, per diode)
IR(mA) 1.E+01 1.E+00
Tj = 150 °C Tj = 125 °C
C(nF) 1.0
F = 1 MHz Vosc = 30 mV
Tj = 25 °C
1.E-01 1.E-02
1.E-03
1.E-04 0
Tj = 100 °C
0.1
Tj = 75 °C Tj = 50 °C
Tj = 25 °C
VR(V) 0.0
10 20 30 40 50 60 70 80 90 100
1
VR(V)
10
100
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Characteristics
STPS15H100C
Figure 7. Forward voltage drop versus forward current (per diode)
Figure 8. Thermal resistance junction to ambient versus copper surface under tab
IFM(A) 100
Tj = 125 °C (Maximum values)
5WKMD &:
(SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV P
'3$.
Tj = 125 °C
(Typical values)
10
(MaTxjim= u2m5 °vCalues)
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
6 FPð
&8
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STPS15H100C
2
Package Information
Package Information
Epoxy meets UL94,V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1
DPAK package information
Figure 9. DPAK package outline
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7KHUPDOSDG
(
+ /
5
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9 *DXJH SODQH
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5 F
Note:
This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
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Package Information
Ref.
A .