DRAM Module
DRAM MODULE
KMM372C80(8)3CK/CS
Buffered 8Mx72 DIMM
(8Mx8 base)
Revision 0.0 June 1999
DRAM MODULE
Revision History
V...
Description
DRAM MODULE
KMM372C80(8)3CK/CS
Buffered 8Mx72 DIMM
(8Mx8 base)
Revision 0.0 June 1999
DRAM MODULE
Revision History
Version 0.0 (June 1999)
The 4th. generation of 64Mb DRAM components are applied for this module.
KMM372C80(8)3CK/CS
DRAM MODULE
KMM372C80(8)3CK/CS
KMM372C80(8)3CK/CS Fast Page Mode 8Mx72 DRAM DIMM with ECC Using 8Mx8, 4K & 8K Refresh, 5V
GENERAL DESCRIPTION
The Samsung KMM372C80(8)3C is a 8Mx72bits Dynamic RAM high density memory module. The Samsung KMM372C80(8)3C consists of nine CMOS 8Mx8bits DRAMs in SOJ/TSOP-II 400mil packages and two 16 bits driver IC in TSSOP package mounted on a 168-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM372C80(8)3C is a Dual In-line Memory Module and is intended for mounting into 168 pin edge connector sockets.
FEATURES Part Identification
Part number KMM372C803CK KMM372C803CS KMM372C883CK KMM372C883CS PKG SOJ TSOP SOJ TSOP 8K 4K/64ms 8K/64ms Ref. 4K CBR Ref. ROR Ref. 4K/64ms
PERFORMANCE RANGE
Speed -5 -6
tRAC
50ns 60ns
tCAC
18ns 20ns
tRC
90ns 110ns
tPC
35ns 40ns
Fast Page Mode Operation CAS-before-RAS Refresh capability RAS-only and Hidden refresh capability TTL compatible inputs and outputs Single 5V±10% power supply JEDEC standard pinout & Buffered PDpin Buffered input except RAS and DQ PCB : Height(1250mil), single sided component
PIN CONFIGURATIONS
Pin Front Pin Front Pin Front 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15...
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