IRLM110A

Advanced Power MOSFET FEATURES ν Avalanche Rugged Technology ν Rugged Gate Oxide Technology ν Lower Input Capacitance ν Improved Gate Charge ν Extended Safe Operating Area ν Lower Leakage Current : 10 µA (Max.) @ VDS = 100V ν Lower RDS(ON) : 0.336 Ω (Typ.) IRLM110A BVDSS = 100 V RDS(on) = 0.44 Ω ID = 1.5 A SOT-223 2 1 3 1. Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ, TSTG TL Characteristic Drain-to-Source Voltage Continuous Drain Current (TC=25 C) Continuous Drain Current (TC=70 C) Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TC=25 C) * Linear Derating Factor * Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8” from case for 5-seconds 300 - 55 to +150 o o o o Value 100 1.5 1.18 (1) Units V A A V mJ A mJ V/ns W W/ C o 12 ±20 60 1.5 0.22 6.5 2.2 0.018 (2) (1) (1) (3) C Thermal Resistance Symbol RθJA Characteristic Junction-to-Ambient * Typ. -Max. 56.8 Units o C/W * When mounted on the minimum pad size recommended (PCB Mount). Rev. A IRLM110A Electrical Characteristics (TC=25 oC unless otherwise specified) Symbol BVDSS ∆BV/∆TJ VGS(th) IGSS IDSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Characteristic Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coeff. Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Lea...