DRAM MODULE
DRAM MODULE
KMM5362203C2W/C2WG
2Mx36 DRAM SIMM
(1MX16 Base)
Revision 0.0 November 1997
-1-
Rev. 0.0 (Nov. 1997)
DR...
Description
DRAM MODULE
KMM5362203C2W/C2WG
2Mx36 DRAM SIMM
(1MX16 Base)
Revision 0.0 November 1997
-1-
Rev. 0.0 (Nov. 1997)
DRAM MODULE
Revision History
Version 0.0 (November 1997)
Changed module PCB from 6-Layer to 4-Layer.
KMM5362203C2W/C2WG
Changed Module Part No. from KMM5362203CW/CWG to KMM5362203C2W/C2WG caused by PCB revision .
-2-
Rev. 0.0 (Nov. 1997)
DRAM MODULE
KMM5362203C2W/C2WG
KMM5362203C2W/C2WG with Fast Page Mode 2M x 36 DRAM SIMM using 1Mx16 and 1Mx4 Quad CAS, 1K Refresh, 5V
GENERAL DESCRIPTION
The Samsung KMM5362203C2W is a 2Mx36bits Dynamic RAM high density memory module. The Samsung KMM5362203C2W consists of four CMOS 1Mx16bits DRAMs in 42-pin SOJ package mounted and two CMOS 1Mx4bit Quad CAS DRAM in 24-pin SOJ package on a 72-pin glassepoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM5362203C2W is a Single In-line Memory Module with edge connections and is intended for mounting into 72 pin edge connector sockets.
FEATURES
Part Identification - KMM5362203C2W(1024 cycles/16ms Ref, SOJ, Solder) - KMM5362203C2WG(1024 cycles/16ms Ref, SOJ, Gold) Fast Page Mode Operation CAS-before-RAS refresh capability RAS-only and Hidden refresh capability TTL compatible inputs and outputs Single +5V ±10% power supply JEDEC standard PDPin & pinout PCB : Height(750mil), double sided component
PERFORMANCE RANGE
Speed -5 -6
tRAC
50ns 60ns
tCAC
15ns 15ns
tRC
90ns 110ns
PIN CONFIGURATIONS
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