PM300CSE060 Datasheet PDF - Mitsubishi Electric Semiconductor

MITSUBISHI MITSUBISHI MODULES> PM300CSE060 PM300CSE060 FLAT-BASE FLAT-BASE TYPE TYPE INSULATED INSULATED PACKAGE PACKAGE PM300CSE060 FEATURE a) Adopting new 4th generation planar IGBT chip, which performance is improved by 1µm fine rule process. For example, typical VCE(sat)=1.7V b) Using new Diode which is designed to get soft reverse recovery characteristics. 3φ 300A, 600V Current-sense IGBT for 15kHz switching Monolithic gate drive & protection logic Detection, protection & status indication circuits for overcurrent, short-circuit, over-temperature & under-voltage Acoustic noise-less 30kW class inverter application APPLICATION General purpose inverter, servo drives and other motor controls PACKAGE OUTLINES Dimensions in mm 135 ±1 120.5 ±0.5 0.5 ±0.3 39.7 LABEL 4- φ5.5 MOUNTING HOLES 24.1 Terminal code 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. VUPC UP VUP1 VVPC VP VVP1 VWPC WP VWP1 VNC 11. 12. 13. 14. 15. 16. VN1 NC UN VN WN FO 16.5 1 23 456 789 11 13 15 10 12 14 16 3.22 10.16 10.16 10.16 20 39.5 10.5 φ2.54 U 51.5 A 2-φ2.54 V 26 16- 95.5 ±0.5 110 ±1 2-2.54 2-2.54 2-2.54 6-2.54 67.4 74.4 20 11 13 W 3.22 4-R6 6-M5 NUTS 2-2.54 0.64 26 0.64 11.6 33.7 34.7 24.1 –0.5 4 +1.0 21.3 A : DETAIL 10.6 Screwing depth Min9.0 5 P N B PPS Sep. 2001 MITSUBISHI PM300CSE060 FLAT-BASE TYPE INSULATED PACKAGE INTERNAL FUNCTIONS BLOCK DIAGRAM Rfo=1.5kΩ WP NC Fo VNC W N VN1 VN UN VWPC V...