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UPD70F3214 Dataheets PDF



Part Number UPD70F3214
Manufacturers NEC Electronics
Logo NEC Electronics
Description (UPD70F3212 - UPD70F3215) 32-Bit Single-Chip Microcontrollers
Datasheet UPD70F3214 DatasheetUPD70F3214 Datasheet (PDF)

User’s Manual V850ES/KG1 32-Bit Single-Chip Microcontrollers Hardware µPD703212 µPD703212(A) µPD703212(A1) µPD703212(A2) µPD703212Y µPD703212Y(A) µPD703212Y(A1) µPD703212Y(A2) µPD703213 µPD703213(A) µPD703213(A1) µPD703213(A2) µPD703213Y µPD703213Y(A) µPD703213Y(A1) µPD703213Y(A2) µPD703214 µPD703214(A) µPD703214(A1) µPD703214(A2) µPD703214Y µPD703214Y(A) µPD703214Y(A1) µPD703214Y(A2) µPD703215 µPD703215Y µPD70F3214 µPD70F3214(A) µPD70F3214Y µPD70F3214Y(A) µPD70F3214H µPD70F3214HY µPD70F3215.

  UPD70F3214   UPD70F3214


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User’s Manual V850ES/KG1 32-Bit Single-Chip Microcontrollers Hardware µPD703212 µPD703212(A) µPD703212(A1) µPD703212(A2) µPD703212Y µPD703212Y(A) µPD703212Y(A1) µPD703212Y(A2) µPD703213 µPD703213(A) µPD703213(A1) µPD703213(A2) µPD703213Y µPD703213Y(A) µPD703213Y(A1) µPD703213Y(A2) µPD703214 µPD703214(A) µPD703214(A1) µPD703214(A2) µPD703214Y µPD703214Y(A) µPD703214Y(A1) µPD703214Y(A2) µPD703215 µPD703215Y µPD70F3214 µPD70F3214(A) µPD70F3214Y µPD70F3214Y(A) µPD70F3214H µPD70F3214HY µPD70F3215H µPD70F3215HY Document No. U16890EJ1V0UD00 (1st edition) Date Published April 2004 N CP(K) 2004 Printed in Japan [MEMO] 2 User’s Manual U16890EJ1V0UD NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. Purchase of NEC Electronics I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. Caution: µ PD70F3214H, 70F3214HY, 70F3215H, and 70F3215HY use SuperFlash TM technology licensed from Silicon Storage Technology, Inc. Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. SuperFlash is a registered trademark or trademark of Silicon Storage Technology, Inc. in several countries including the United States and Japan. User’s Manual U16890EJ1V0UD 3 These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited. • The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual pro.


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