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APPLICATION SPECIFIC CAPACITORS HIGH FREQUENCY CERAMIC CAPACITORS MA/MB Series
OUTSTANDING CHARACTERISTICS
I Miniature size I Very high Q at high frequencies I High RF power capabilities I Impervious to environmental conditions I Low dissipation factors I Excellent retrace capability (not applicable for X7R styles) I High temperature stability I Low noise I Meets Mil-55681 with respect to: Shock, Vibration, Moisture Resistance, Solderability, Barometric Pressure, Temperature Cycling, Immersion and Salt Spray
ADDITIONAL FEATURES
I Packaging options I Lot processing data available
MA SERIES
For filtering, coupling and impedance matching in most RF circuits, the MA Series chips and leaded devices offer outstanding performance and reliability with the greatest range of values and configurations. MA Series capacitors can be supplied with military equivalent screening. Please consult our factory. MA Series ceramic fixed capacitors are miniature, high performance precision components having extremely high Q and high power capabilities from low frequencies to gigahertz ranges. These “low loss” multilayer capacitors are extremely stable with respect to variations in temperature, voltage and frequency. MA Series capacitors are designed for miniature state-of-the-art circuit applications. They are small, easy to apply and have excellent reliability. Units are available in ultra-miniature case size 1 (1.4 x 1.4 x 1.4mm) or miniature case size 2 (2.8 x 2.8 x 2.5mm). Standard case size 1 units are available as chips. Standard case size 2 units are available as chips and also in leaded configurations. Clean-room manufacturing technology assures product reliability and automated processing reduces costs and cycle time. Key stages of the operation are monitored and controlled with the latest SPC techniques. Flexibility in design allows the production of non-standard values, while maintaining consistent quality objectives. Please contact the factory for availability of special configurations or high-reliability screening.
PART NUMBERING SYSTEM – CASE SIZE 1 & CASE SIZE 2
M A 1 8 101 J A N
CUBIC MONOLITHIC
A-STD SERIES B-ULTRA HIGH Q
DIMENSIONAL AND T.C. CODE 1: P90 Case 1 5: COG Case 1 7: X7R Case 1 2: P90 Case 2 6: COG Case 2 8: X7R Case 2
TERMINATION CODE: 0: Chip 1: Pellet 2: Microstrip 3: Radial Ribbon 4: Radial Wire 5: Axial Ribbon 6: Narrow Axial Ribbon 7: Axial Wire 8: Nickel Interfaced Pellet 9: Nickel Interfaced Chip
CAPACITANCE TOLERANCES: CODE: Expressed *B: ±0.1pF in picofarads and *C : ±0.25pF identified by a three-digit *D: ±0.5pF number. First two digits F : ±1% represent significant G: ±2% figures. Last digit J : ±5% specifies the number K: ±10% of zeros to follow. For M: ±20% values below 10pF, Z: +80%, –20% the letter “R” is used as the decimal point and the last digit becomes significant.
A: NO 7” Reel MARKING Plastic B: MARKING Tape Cap. Code & Tol. Logo if space permits Non XR7 styles only *Available below 10pf only
SPECIAL LEAD CONFIGURATION FOR FLEX BOARDS
NOTE: Targeted for flex circuit boards, the MA22-6 version of the MA22 has an upraised lead configuration. The lead bends when flexing the board after assembly so that minimal stress is placed on the component.
Type Style P90 ± 20 P90 ± 30 COG X7R Configuration
W L T
Dimensions: mm L ± 0.38* W ± 0.38* T ± .038 Band Y Termination
Silver Ribbon:
W NE
Raised Micro-Strip
MA22-6 MB22-6
MA62-6 MA82-6
Y
3.4
2.8
2.8
0.38 ± .25
Length: 6.35 typical Width: 2.3 ± .13 Thickness: 0.1 ± .05
118
CG01-J
APPLICATION SPECIFIC CAPACITORS HIGH FREQUENCY CERAMIC CAPACITORS MA/MB Series
DIMENSIONS
Fig. 1 Chip
W L T
Fig. 2 Pellet
L W T
Fig. 3 Micro-Strip
L W T
Fig. 4 Radial Ribbon
W L
Y Y Y Y T
Fig. 5 Radial Wire
L T
Fig. 6 Axial Ribbon
W L
Fig. 7 Narrow Axial Ribbon
W L
Fig. 8 Axial Wire
W L
Y
W
Y
T
Y
T
Y
T
CONFIGURATION AND DIMENSIONS – MA & MB SERIES
Type Style P90 ± 20 P90 ± 30 MA10 MA11 MA18 — — — COG MA50 MA51 MA58 X7R MA70 MA71 MA78 Figure Case Size Dimensions: mm Configuration L ± 0.38* 1.4 ± .25 1 EIA Style 0505 W ± 0.38* T max. Band Y Termination
APPLICATION SPECIFIC CAPACITORS
Chip Pellet Nickel Interfaced Pellet Nickel Interfaced Chip Chip Pellet Micro Strip
1 2 2
Palladium Silver Palladium Silver & Sn62 Solder
1.8 max.
1.4 ± .25
1.4
0.25 ± .1
Palladium Silver, Nickel Interface & Sn62 Solder Palladium Silver, Nickel Interface & Tin Plating Palladium Silver Palladium Silver, & Sn62 Solder Silver Ribbon: 6.35 x 2.3 x 0.1mm
MA19
—
MA59
MA79
1
1.4 ± .25
MA20 MA21
MB20 MB21
MA60 MA61
MA80 MA81
1 2
2.8 3.3 max.
MA22
MB22
MA62
MA82
3
3.4
Radial Ribbon
MA23
MB23
MA63
MA83
4
3.4
Silver Ribbon: 6.35 x 2.3 x 0.1mm
Radial Wire
MA24
MB24
MA64
MA84
5 2 EIA Style 1010
3.8
#26AWG Silver Wire: 12.7 x 0.4mm Dia.
Axial Ribbon
MA25
MB25
MA65
MA85
6
3.4
2.8
2.5
0.38 ± .25
Silver Ribbon: 6.35 x 2.3 x 0.1mm
Narrow Axial Ribbon
MA26
MB26
MA66
MA86
7
3.4
Silver Ribbon: 6.35 x 1.25 x 0.