PRESSURE SENSOR. MPX4101 Datasheet

MPX4101 SENSOR. Datasheet pdf. Equivalent

Part MPX4101
Description INTEGRATED PRESSURE SENSOR
Feature MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX4101/D MPX4101 Integrated Silicon.
Manufacture Motorola
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MPX4101
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX4101/D
MPX4101
Integrated Silicon Pressure Sensor
SERIES
Manifold Absolute Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The Motorola MPX4101 series Manifold Absolute Pressure (MAP) sensor for engine
control is designed to sense absolute air pressure within the intake manifold. This
measurement can be used to compute the amount of fuel required for each cylinder. The
small form factor and high reliability of on–chip integration makes the Motorola MAP
sensor a logical and economical choice for automotive system designers.
INTEGRATED
PRESSURE SENSOR
15 to 102 kPa
(2.18 to 14.8 psi)
0.25 to 4.95 V Output
Features
1.7% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine
Control Systems
Ideally Suited for Microprocessor Interfacing
Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over – 40°C to +125°C
Durable Epoxy Unibody Element
Ideal for Non–Automotive Applications
Application Examples
Manifold Sensing for Automotive Systems
VS
BASIC CHIP CARRIER
ELEMENT
CASE 867–08, STYLE 1
PIN NUMBER
1 Vout 4 N/C
2 Gnd 5 N/C
3 VS 6 N/C
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.
3
X–ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1
Vout
2 PINS 4, 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
The MPX4101 series piezoresistive transducer is a state–
of–the–art, monolithic, signal conditioned, silicon pressure
sensor. This sensor, with its patented transducer, combines
advanced micromachining techniques, thin film metallization,
and bipolar semiconductor processing to provide an
accurate, high level analog output signal that is proportional
to applied pressure.
Figure 1 shows a block diagram of the internal circuitry in-
tegrated on a pressure sensor chip.
Senseon and X–ducer are trademarks of Motorola, Inc.
© MMotootroolrao, lIanc.S1e9n97sor Device Data
1



MPX4101
MPX4101 SERIES
MAXIMUM RATINGS(1)
Parametric
Symbol
Overpressure(2) (P1 > P2)
Burst Pressure(2) (P1 > P2)
Pmax
Pburst
Storage Temperature
Tstg
Operating Temperature
TA
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Value
400
1000
– 40 to +125
– 40 to +125
Unit
kPa
kPa
°C
°C
OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Pressure Range(1)
Supply Voltage(1)
POP
VS
15
4.85
Supply Current
Minimum Pressure Offset(3)
@ VS = 5.1 Volts
Full Scale Output(4)
@ VS = 5.1 Volts
Full Scale Span(5)
@ VS = 5.1 Volts
Accuracy(6)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Io
Voff
VFSO
VFSS
0.171
4.870
Sensitivity
Response Time(7)
V/P —
tR —
Output Source Current at Full Scale Output
Warm–Up Time(8)
Offset Stability(9)
Io+ —
——
——
Decoupling circuit shown in Figure 3 required to meet electrical specifications.
Typ
5.1
7.0
0.252
4.951
4.7
54
1.0
0.1
20
± 0.5
Max
102
5.35
10
0.333
5.032
±1.72
Unit
kPa
Vdc
mAdc
Vdc
Vdc
Vdc
%VFSS
mV/kPa
ms
mAdc
ms
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max Unit
Weight, Basic Element (Case 867)
Common Mode Line Pressure(10)
— — 4.0 — Grams
— — — 690 kPa
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan:
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.
2 Motorola Sensor Device Data





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