MSL-174SO

Surface Mount Chip LEDs Description The MSL-174SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. 1.25 ( 0.049 ) MSL-174SO Package Dimensions CATHODE MARK POLARITY 2.0 ( 0.079) 1.40 (0.055) 0.80 (0.031) 1.25 (0.049) Applications l l l l 0.30 ( 0.012 ) Small Size Industry Standard Footprint(0805) Compatible with IR Solder process Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels R0.2 (0.008) PCB 0.40 (0.016) SOLDERING TERMINAL Recommended Solder Patterns Features l l l l Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator 1.20 (0.047) 0.90 (0.035) 1.20 (0.047) Absolute Maximum Ratings NOTE: 1. All dimensions are in millimeter (inches) 2. Tolerance is ± 0.1mm (.004") unless otherwise specified. @ TA=25oC Parameter Peak Forward Current(1/10 Duty Cycle@1KHz ) DC Forward Current Power Dissipation Reverse Voltage Operating Temperature Range Storage Temperature Range Symbol IFP IF PD VR TOPR TSTG Maximum Rating 100 25 63 5 -20 C to +80 C o o Unit mA mA mW V -30oC to +100oC Unity Opto Technology Co., Ltd. 1.20 (.047) 11/24/2000 MSL-174SO Optical-Electrical Characteristics Parameter Luminous Intensity Forward Voltage Reverse Current Peak/Dominant Wavelength Spectral Linewidth Viewing Angle Test Conditions IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA Symbol IV VF IR λp/λd ∆λ 2θ1/2 Min . 40 Typ...