742C163xxx

Resistor Chip Arrays Technical Data Features Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits Concave and Convex Options RoHS Compliant Version Available Product Benefits High Density Packaging Up to 30% less space per resistor than 0603 chip resistors Up to 75% less space per resistor than 0805 chip resistors Placement Efficiency Networks require fewer placements than discrete components Larger overall size eases handling compared to discrete components Low Profile; Can be used in PCMCIA cards Electrical and Mechanical Specifications Series 741 742 743 744 745 746 PCB Area (in²) Per Resistor .0015 .0037 .0071 .0094 .0058 .0013 m o .c U 4 t e e h S a t a .D w w w Circuit Type Isolated Isolated Isolated Isolated Bussed Bussed Resistance 70°C Power Range, Ohms Per Resistor* 10 - 1M .063W 10 - 1M .063W 10 - 1M .100W 10 - 1M .125W 33 - 470K .063W 33 - 100K .031W Standard: ±5% or .5Ω (whichever is greater) -55°C to +125°C Standard: 200PPM/°C Maximum Operating Voltage 25V 50V 100V 200V 50V 25V *Total Rated Package Power equals total number of resistors times rated Power Per Resistor Resistance Tolerance Operating Temperature Range Temperature Coefficient Page 1 of 5 CTS Electronic Components m o .c U t4 e e 2005 August h aS t a www.ctscorp.com .D w w w Package Outlines Concave Termination – Type C L P B T C Termination A...