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HD64F2633 Dataheets PDF



Part Number HD64F2633
Manufacturers Hitachi
Logo Hitachi
Description (HD64F263x Series) 16-Bit MICROCONTROLLER
Datasheet HD64F2633 DatasheetHD64F2633 Datasheet (PDF)

m o .c U 4 t To all our customers e e h S a Information regarding change of names mentioned at within this document, to Renesas Technology Corp. .D w w w On April 1st 2003 the following semiconductor operations were transferred to Renesas Technology Corporation: operations covering microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.). Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are.

  HD64F2633   HD64F2633


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m o .c U 4 t To all our customers e e h S a Information regarding change of names mentioned at within this document, to Renesas Technology Corp. .D w w w On April 1st 2003 the following semiconductor operations were transferred to Renesas Technology Corporation: operations covering microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.). Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have all been changed to Renesas Technology Corporation. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Thank you for your understanding. Renesas Technology Home Page: www.renesas.com m o .c U 4 t e e h S a t a .D w w w Renesas Technology Corp. April 1, 2003 m o .c U 4 t e e h S a at Renesas Technology Corp. .D w w w H8S/2633 Series H8S/2633 HD6432633 H8S/2632 HD6432632 H8S/2631 HD6432631 H8S/2633 F-ZTAT™ HD64F2633 H8S/2633R F-ZTAT™ HD64F2633R H8S/2695 HD6432695 Hardware Manual ADE-602-165C Rev. 4.0 8/29/02 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. General Precautions on the Handling of Products 1. Treatment of NC Pins Note: Do not connect anything to the NC pins. The NC (not connected) pins are either not connected to any of the internal circuitry; or are used as test pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed. 2. Treatment of Unused Input Pins Note: Fix all unused input pins to high or low level. Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur. 3. Processing before Initialization Note: When power is first supplied, the product’s state is undefined. The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is input on the reset pin. During the period where the states are undefined, the register settings and the output state of each pin are also undefined. Design your system so that it does not malfunction because of processing while it is in this undefined state. For those products which have a reset function, reset the LSI immediately after the power supply has been turned on. 4. Prohibition of Access to Undefined or Reserved Address Note: Access to undefined or reserved addresses is prohibited. The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated to these address. Do not access these registers: the system’s operation is not guaranteed if they are accessed. Preface These LSIs are high-performance microcomputers with a 32-bit.


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