(MT58LxxxLxxD) 2Mb SRAM
m o .c U 4 t ™ e 2Mb SYNCBURST e h SRAM S a t a D . FEATURES w w w
NOT RECOMENDED FOR NEW DESIGNS
2Mb: 128K x 18, 64K ...
Description
m o .c U 4 t ™ e 2Mb SYNCBURST e h SRAM S a t a D . FEATURES w w w
NOT RECOMENDED FOR NEW DESIGNS
2Mb: 128K x 18, 64K x 32/36 PIPELINED, DCD SYNCBURST SRAM MT58L128L18D, MT58L64L32D, MT58L64L36D
3.3V VDD, 3.3V I/O, Pipelined, Double-Cycle Deselect
Fast clock and OE# access times Single +3.3V +0.3V/-0.165V power supply (VDD) Separate +3.3V isolated output buffer supply (VDDQ) SNOOZE MODE for reduced-power standby Common data inputs and data outputs Individual BYTE WRITE control and GLOBAL WRITE Three chip enables for simple depth expansion and address pipelining Clock-controlled and registered addresses, data I/Os and control signals Internally self-timed WRITE cycle Burst control pin (interleaved or linear burst) Automatic power-down 100-pin TQFP package Low capacitive bus loading x18, x32, and x36 options available
OPTIONS
Timing (Access/Cycle/MHz) 3.5ns/6ns/166 MHz 4.0ns/7.5ns/133 MHz 5ns/10ns/100 MHz Configurations 128K x 18 64K x 32 64K x 36 Packages 100-pin TQFP
Operating Temperature Range Commercial (0°C to +70°C)
MT58L128L18DT-10
m o .c U 4 t e e h S a t a .D w w w
*JEDEC-standard MS-026 BHA (LQFP).
100-Pin TQFP*
MARKING
-6 -7.5 -10
MT58L128L18D MT58L64L32D MT58L64L36D T
None
Part Number Example:
GENERAL DESCRIPTION
The Micron® SyncBurst™ SRAM family employs high- speed, low-power CMOS designs that are fabricated using an advanced CMOS process. Micron’s 2Mb SyncBurst SRAMs integrate a 128K x 18, 64K x 32, or 64K x 36 SR...
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