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RD38F2240 Dataheets PDF



Part Number RD38F2240
Manufacturers Intel
Logo Intel
Description (RD38F2240xxxx) MIXED MEMORY
Datasheet RD38F2240 DatasheetRD38F2240 Datasheet (PDF)

Intel® Wireless Flash Memory (W18/W30 SCSP) 32WQ and 64WQ Family with Asynchronous RAM Datasheet Product Features ■ ■ ■ ■ ■ Device Architecture — Flash Density: 32-Mbit, 64-Mbit — Async PSRAM Density: 8-, 16-, 32Mbit; Async SRAM Density: 4-, 8-, 16Mbit — Top, Bottom or Dual flash parameter configuration Device Voltage — Flash VCC = 1.8 V; Flash VCCQ = 1.8 V or 3.0 V — RAM VCC = 3.0 V; RAM VCCQ = 1.8 V or 3.0 V Device Packaging — 88 balls (8 x 10 active ball matrix); Area: 8x10 mm; Height:.

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Document
Intel® Wireless Flash Memory (W18/W30 SCSP) 32WQ and 64WQ Family with Asynchronous RAM Datasheet Product Features ■ ■ ■ ■ ■ Device Architecture — Flash Density: 32-Mbit, 64-Mbit — Async PSRAM Density: 8-, 16-, 32Mbit; Async SRAM Density: 4-, 8-, 16Mbit — Top, Bottom or Dual flash parameter configuration Device Voltage — Flash VCC = 1.8 V; Flash VCCQ = 1.8 V or 3.0 V — RAM VCC = 3.0 V; RAM VCCQ = 1.8 V or 3.0 V Device Packaging — 88 balls (8 x 10 active ball matrix); Area: 8x10 mm; Height: 1.2 mm to 1.4 mm PSRAM Performance — 70 ns initial access, 25 ns async page reads at 1.8 V I/O — 70 ns initial access async PSRAM at 1.8V I/O — 88 ns initial access, 30 ns async page reads at 1.8 V I/O — 85 ns initial access, 35 ns async page reads at 3.0 V I/O — 70 ns initial access, 25 ns async page reads at 3.0 V I/O SRAM Performance — 70 ns initial access at 1.8 V or 3.0 V I/O ■ ■ ■ ■ Flash Performance — 65 ns initial access at 1.8 V I/O — 70 ns initial access at 3.0 V I/O — 25 ns async page at 1.8 V or 3.0 V I/O — 14 ns sync reads (tCHQV) at 1.8 V I/O — 20 ns sync reads (tCHQV) at 3.0 V I/O — Enhanced Factory Programming: 3.10 µs/Word (Typ) Flash Architecture — Read-While-Write/Erase — Asymmetrical blocking structure — 4-KWord parameter blocks (Top or Bottom); 32-KWord main blocks — 4-Mbit partition size — 128-bit One-Time Programmable (OTP) Protection Register — Zero-latency block locking — Absolute write protection with block lock using F-VPP and F-WP# Flash Software — Intel® Flash Data Integrator (FDI) and Common Flash Interface (CFI) Quality and Reliability — Extended Temperature: –25 °C to +85 °C — Minimum 100K flash block erase cycle — 90 nm ETOX™ IX flash technology — 130 nm ETOX™ VIII flash technology The Intel® Wireless Flash Memory (W18/W30 SCSP) family offers various flash plus static RAM combinations in a common package footprint. The flash memory features 1.8 V lowpower operations with flexible, multi-partition, dual-operation Read-While-Write / Read-WhileErase, asynchronous, and synchronous reads. This SCSP device integrates up to two flash die, one PSRAM die, and one SRAM die in a low-profile package compatible with other SCSP families with QUAD+ ballout. Order Number: 251407, Revision: 010 www.DataSheet4U.com 18-Oct-2005 www.DataSheet4U.com www.DataSheet4U.com INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Le ga l Lin es an d Discla ime rs Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. *Other names and brands may be claimed as the property of others. Copyright © 2005, Intel Corporation. All Rights Reserved. 18-Oct-2005 2 Intel® Wireless Flash Memory (W18/W30 SCSP) Order Number: 251407, Revision: 010 Datasheet 32WQ and 64WQ Family—Intel® Wireless Flash Memory (W18/W30 SCSP) 1.0 Introduction....................................................................................................................................6 1.1 1.2 Nomenclature ....................................................................................................................... 6 Conventions.......................................................................................................................... 6 2.0 Functional Overview .....................................................................................................................8 2.1 2.2 Block Diagram ...................................................................................................................... 8 Flash Memory Map and Partitioning ............


SES5504 RD38F2240 7530A5524


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