BIDIRECTIONAL TRANSCEIVER. MC74ACT245 Datasheet
Transceiver with 3-State
The MC74AC245/74ACT245 contains eight non−inverting
bidirectional buffers with 3−state outputs and is intended for
bus−oriented applications. Current sinking capability is 24 mA at both
the A and B ports. The Transmit/Receive (T/R) input determines the
direction of data flow through the bidirectional transceiver. Transmit
(active−HIGH) enables data from A ports to B ports; Receive
(active−LOW) enables data from B ports to A ports. The Output
Enable input, when HIGH, disables both A and B ports by placing
them in a High Z condition.
• Noninverting Buffers
• Bidirectional Data Path
• A and B Outputs Source/Sink 24 mA
• ′ACT245 has TTL Compatible Inputs
• These are Pb−Free Devices
Output Enable Input
Side A 3−State Inputs or 3−State Outputs
Side B 3−State Inputs or 3−State Outputs
L L Bus B Data to Bus A
L H Bus A Data to Bus B
H X High Z State
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
VCC OE B0 B1 B2 B3 B4 B5 B6 B7
20 19 18 17 16 15 14 13 12 11
1 2 3 4 5 6 7 8 9 10
T/R A0 A1 A2 A3 A4 A5 A6 A7 GND
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 8
Publication Order Number:
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND) (Note 1)
DC Input Diode Current
DC Output Diode Current
DC Output Sink/Source Current
DC Supply Current, per Output Pin
DC Ground Current, per Output Pin
Storage Temperature Range
Lead temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance (Note 2)
−0.5 to +7.0
−0.5 to VCC +0.5
−0.5 to VCC +0.5
*65 to )150
MSL Moisture Sensitivity
ESD Withstand Voltage
Oxygen Index: 30% − 35%
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
UL 94 V−0 @ 0.125 in
ILatchup Latchup Performance
Above VCC and Below GND at 85_C (Note 6)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IOUT absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD 51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Min Typ Max Unit
VCC Supply Voltage
2.0 5.0 6.0
4.5 5.0 5.5
VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 7)
tr, tf ′AC Devices except Schmitt Inputs
VCC @ 3.0 V − 150 −
VCC @ 4.5 V
VCC @ 5.5 V
Input Rise and Fall Time (Note 8)
tr, tf ′ACT Devices except Schmitt Inputs
VCC @ 4.5 V
VCC @ 5.5 V − 8.0 −
TA Operating Ambient Temperature Range
IOH Output Current − High
− − −24 mA
IOL Output Current − Low
− − 24 mA
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
8. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.