flat package. SOT545-3 Datasheet

SOT545-3 package. Datasheet pdf. Equivalent


NXP SOT545-3
( DataSheet : www.DataSheet4U.com )
Philips Semiconductors
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
PDF: 2004 Feb 05
Package outline
SOT545-3
y exposed die pad side
36
37
Dh
c
X
25
24 Z E
A
Eh
48
1
e
pin 1 index
wM
bp
D
HD
e
E HE
wM
bp
A A2 A1
13
12
ZD
vM A
B
vM B
detail X
(A3)
θ
Lp
L
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT max. A1 A2 A3 bp
c D(1) Dh E(1) Eh
e
HD HE
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
7.1
6.9
3.6
3.4
7.1
6.9
3.6
3.4
0.5
9.1
8.9
9.1
8.9
L Lp v w y ZD(1) ZE(1) θ
1
0.75
0.45
0.2
0.08 0.08
0.9
0.6
0.9
0.6
7°
0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT545-3
IEC
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
04-02-05
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SOT545-3 Datasheet
Recommendation SOT545-3 Datasheet
Part SOT545-3
Description plastic thermal enganced thin quad flat package
Feature SOT545-3; ( DataSheet : www.DataSheet4U.com ) PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQF.
Manufacture NXP
Datasheet
Download SOT545-3 Datasheet






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