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PEB2070 Dataheets PDF



Part Number PEB2070
Manufacturers Infineon Technologies
Logo Infineon Technologies
Description ISDN Communication Controller
Datasheet PEB2070 DatasheetPEB2070 Datasheet (PDF)

ICs for Communications ISDN Communication Controller ICC PEB 2070 PEF 2070 User’s Manual 01.94 PEB 2070; PEF 2070 Revision History: Previous Releases: Page 01.94 06.92 Subjects (changes since last revision) Update Data Classification Maximum Ratings Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Characteristics The listed characteristics are ensured over the operating range of the integrated circuit. Typical .

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ICs for Communications ISDN Communication Controller ICC PEB 2070 PEF 2070 User’s Manual 01.94 PEB 2070; PEF 2070 Revision History: Previous Releases: Page 01.94 06.92 Subjects (changes since last revision) Update Data Classification Maximum Ratings Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Characteristics The listed characteristics are ensured over the operating range of the integrated circuit. Typical characteristics specify mean values expected over the production spread. If not otherwise specified, typical characteristics apply at TA = 25 °C and the given supply voltage. Operating Range In the operating range the functions given in the circuit description are fulfilled. For detailed technical information about “Processing Guidelines” and “Quality Assurance” for ICs, see our “Product Overview”. Edition 01.94 This edition was realized using the software system FrameMaker®. Published by Siemens AG, Bereich Halbleiter, Marketing-Kommunikation, Balanstraße 73, D-81541 München © Siemens AG 1994. All Rights Reserved. As far as patents or other rights of third parties are concerned, liability is only assumed for components , not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery, and prices please contact the Offices of Semiconductor Group in Germany or the Siemens Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the type in question please contact your nearest Siemens Office, Semiconductor Group. Siemens AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. General Information Table of Contents 1 1.1 1.2 1.3 1.4 1.5 1.5.1 1.5.2 1.5.3 2 2.1 2.2 2.2.1 2.2.2 2.2.3 2.3 2.3.1 2.3.2 2.3.3 2.3.4 2.4 2.4.1 2.4.1.1 2.4.1.2 2.4.1.3 2.4.1.4 2.4.2 2.4.3 2.4.4 2.4.5 2.4.6 2.4.7 2.4.8 3 3.1 3.2 3.3 3.4 3.5 3.5.1 3.5.2 3.5.2.1 3.5.2.2 Page Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ISDN Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Other Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Microprocessor Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 General Functions and Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Serial Interface Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 IOM®-1 Mode (IMS = 0, DIM2 = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 IOM®-2 Mode (IMS = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 HDLC Controller Mode (IMS = 0, DIM2 = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 mP Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 ISDN Oriented Modular (IOM®) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 SSI (Serial Port A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 SLD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Individual Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Layer.


TX02-4400 PEB2070 PEB2070


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