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TRI-STATE Outputs. 54F245 Datasheet

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TRI-STATE Outputs. 54F245 Datasheet






54F245 Outputs. Datasheet pdf. Equivalent




54F245 Outputs. Datasheet pdf. Equivalent





Part

54F245

Description

Octal Bidirectional Transceiver with TRI-STATE Outputs



Feature


Obsolete 54F 74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs Ju ne 1995 54F 74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs Ge neral Description The ’F245 contains eight non-inverting bidirectional buffe rs with TRI-STATE outputs and is intend ed for bus-oriented applications Curren t sinking capability is 24 mA (20 mA Mi l) at the A ports an.
Manufacture

National Semiconductor

Datasheet
Download 54F245 Datasheet


National Semiconductor 54F245

54F245; d 64 mA (48 mA Mil) at the B ports The T ransmit Receive (T R) input determines the direction of data flow through the bidirectional transceiver Transmit (act ive HIGH) enables data from A ports to B ports Receive (active LOW) enables da ta from B ports to A ports The Output E nable input when HIGH disables both A a nd B ports by placing them in a High Z condition Feature.


National Semiconductor 54F245

s Y Non-inverting buffers Y Bidirectiona l data path Y A outputs sink 24 mA (20 mA Mil) Y B outputs sink 64 mA (48 mA M il) Y Guaranteed 4000V minimum ESD prot ection Commercial 74F245PC 74F245SC (N ote 1) 74F245SJ (Note 1) 74F245MSA (Not e 1) Military 54F245DM (Note 2) 54F245 FM (Note 2) 54F245LM (Note 2) Package Number N20A J20A M20B M20D MSA20 W20A E 20A Package Descr.


National Semiconductor 54F245

iption 20-Lead (0 300 Wide) Molded Dual- In-Line 20-Lead Ceramic Dual-In-Line 20 -Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Smal l Outline EIAJ 20-Lead Molded Shrink Sm all Outline EIAJ Type II 20-Lead Cerpac k 20-Lead Ceramic Leadless Chip Carrier Type C Note 1 Devices also available in 13 reel Use suffix e SCX SJX and MSA X Note 2 Military .

Part

54F245

Description

Octal Bidirectional Transceiver with TRI-STATE Outputs



Feature


Obsolete 54F 74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs Ju ne 1995 54F 74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs Ge neral Description The ’F245 contains eight non-inverting bidirectional buffe rs with TRI-STATE outputs and is intend ed for bus-oriented applications Curren t sinking capability is 24 mA (20 mA Mi l) at the A ports an.
Manufacture

National Semiconductor

Datasheet
Download 54F245 Datasheet




 54F245
June 1995
54F 74F245
Octal Bidirectional Transceiver with TRI-STATE Outputs
General Description
The ’F245 contains eight non-inverting bidirectional buffers
with TRI-STATE outputs and is intended for bus-oriented
applications Current sinking capability is 24 mA (20 mA Mil)
at the A ports and 64 mA (48 mA Mil) at the B ports The
Transmit Receive (T R) input determines the direction of
data flow through the bidirectional transceiver Transmit (ac-
tive HIGH) enables data from A ports to B ports Receive
(active LOW) enables data from B ports to A ports The
Output Enable input when HIGH disables both A and B
ports by placing them in a High Z condition
Features
Y Non-inverting buffers
Y Bidirectional data path
Y A outputs sink 24 mA (20 mA Mil)
Y B outputs sink 64 mA (48 mA Mil)
Y Guaranteed 4000V minimum ESD protection
Commercial
74F245PC
74F245SC (Note 1)
74F245SJ (Note 1)
74F245MSA (Note 1)
Military
54F245DM (Note 2)
54F245FM (Note 2)
54F245LM (Note 2)
Package
Number
N20A
J20A
M20B
M20D
MSA20
W20A
E20A
Package Description
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead Molded Shrink Small Outline EIAJ Type II
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX SJX and MSAX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB
Logic Symbols
IEEE IEC
TL F 9503 – 3
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9503
TL F 9503 – 4
RRD-B30M75 Printed in U S A




 54F245
Connection Diagrams
Pin Assignment for
DIP SOIC SSOP and Flatpak
Pin Assignment
for LCC
TL F 9503–1
Unit Loading Fan Out
Pin Names
OE
TR
A0 – A7
B0 – B7
Description
Output Enable Input (Active LOW)
Transmit Receive Input
Side A Inputs or
TRI-STATE Outputs
Side B Inputs or
TRI-STATE Outputs
54F 74F
UL
HIGH LOW
10 20
10 20
3 5 1 083
150 40(38 3)
3 5 1 083
600 106 6(80)
Input IIH IIL
Output IOH IOL
20 mA b1 2 mA
20 mA b1 2 mA
70 mA b0 65 mA
b3 mA 24 mA (20 mA)
70 mA b0 65 mA
b12 mA 64 mA (48 mA)
Truth Table
Inputs
OE T R
LL
LH
HX
H e HIGH Voltage Level
L e LOW Voltage Level
X e Immaterial
Output
Bus B Data to Bus A
Bus A Data to Bus B
High Z State
TL F 9503 – 2
2




 54F245
Absolute Maximum Ratings (Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
b65 C to a150 C
Ambient Temperature under Bias
b55 C to a125 C
Junction Temperature under Bias
Plastic
b55 C to a175 C
b55 C to a150 C
VCC Pin Potential to
Ground Pin
b0 5V to a7 0V
Input Voltage (Note 2)
b0 5V to a7 0V
Input Current (Note 2)
b30 mA to a5 0 mA
Voltage Applied to Output
in HIGH State (with VCC e 0V)
Standard Output
TRI-STATE Output
b0 5V to VCC
b0 5V to a5 5V
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
ESD Last Passing Voltage (Min)
4000V
Note 1 Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
Note 2 Either voltage limit or current limit is sufficient to protect inputs
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b55 C to a125 C
0 C to a70 C
Supply Voltage
Military
Commercial
a4 5V to a5 5V
a4 5V to a5 5V
DC Electrical Characteristics
Symbol
Parameter
54F 74F
Min Typ Max
Units VCC
Conditions
VIH
VIL
VCD
VOH
VOL
IIH
Input HIGH Voltage
Input LOW Voltage
Input Clamp Diode Voltage
Output HIGH
Voltage
Output LOW
Voltage
Input HIGH
Current
54F 10% VCC
54F 10% VCC
74F 10% VCC
74F 10% VCC
74F 5% VCC
54F 10% VCC
54F 10% VCC
74F 10% VCC
74F 10% VCC
54F
74F
20
24
20
24
20
27
V Recognized as a HIGH Signal
08 V
Recognized as a LOW Signal
b1 2 V Min IIN e b18 mA
IOH e b3 mA (An)
IOH e b12 mA (Bn)
V Min IOH e b3 mA (An)
IOH e b15 mA (Bn)
IOH e b3 mA (An)
05
0 55
05
0 55
IOL e 20 mA (An)
V Min IOL e 48 mA (Bn)
IOL e 24 mA (An)
IOL e 64 mA (Bn)
20 0
50
mA Max VIN e 2 7V
Input HIGH Current 54F
IBVI Breakdown Test 74F
100
7 0 mA Max VIN e 7 0V (OE T R)
IBVIT
Input HIGH Current 54F
Breakdown (I O) 74F
10
0 5 mA Max VIN e 5 5 V (An Bn)
ICEX
Output HIGH
54F
Leakage Current 74F
250
50 mA Max VOUT e VCC (An Bn)
Input Leakage
VID Test
74F
4 75
V 0 0 IID e 1 9 mA
All Other Pins Grounded
Output Leakage
IOD
Circuit Current
74F
3 75 mA 0 0 VIOD e 150 mV
All Other Pins Grounded
IIL
IIH a IOZH
IIL a IOZL
Input LOW Current
Output Leakage Current
Output Leakage Current
b1 2 mA Max VIN e 0 5V (T R OE)
70 mA Max VOUT e 2 7V (An Bn)
b650 mA Max VOUT e 0 5V (An Bn)
3






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