Multi-Purpose Flash. 39SF010 Datasheet

39SF010 Flash. Datasheet pdf. Equivalent

Part 39SF010
Description (sst39SF010 / SST39SF512) 512 Kbit / 1 Mbit (x8) Multi-Purpose Flash
Feature www.DataSheet4U.com 512 Kbit / 1 Mbit (x8) Multi-Purpose Flash SST39SF512 / SST39SF010 SST39SF512 /.
Manufacture Silicon Storage Technology
Datasheet
Download 39SF010 Datasheet



39SF010
www.DataSheet4U.com
512 Kbit / 1 Mbit (x8) Multi-Purpose Flash
SST39SF512 / SST39SF010
FEATURES:
SST39SF512 / 0105.0V 512Kb / 1Mb (x8) MPF memories
Data Sheet
• Organized as 64K x8 / 128K x8
• Single 5.0V Read and Write Operations
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
Low Power Consumption:
Active Current: 20 mA (typical)
Standby Current: 10 µA (typical)
Sector-Erase Capability
Uniform 4 KByte sectors
Fast Read Access Time:
70 ns
90 ns
Latched Address and Data
Fast Erase and Byte-Program:
Sector-Erase Time: 7 ms (typical)
Chip-Erase Time: 15 ms (typical)
Byte-Program Time: 20 µs (typical)
Chip Rewrite Time:
2 seconds (typical) for SST39SF512
3 seconds (typical) for SST39SF010
Automatic Write Timing
Internal VPP Generation
End-of-Write Detection
Toggle Bit
Data# Polling
TTL I/O Compatibility
JEDEC Standard
Flash EEPROM Pinouts and command sets
Packages Available
32-pin PLCC
32-pin TSOP (8mm x 14mm)
32-pin PDIP
PRODUCT DESCRIPTION
The SST39SF512/010 are CMOS Multi-Purpose Flash
(MPF) manufactured with SSTs proprietary, high perfor-
mance CMOS SuperFlash technology. The split-gate cell
design and thick oxide tunneling injector attain better reli-
ability and manufacturability compared with alternate
approaches. The SST39SF512/010 devices write (Pro-
gram or Erase) with a 5.0V-only power supply. The
SST39SF512/010 device conforms to JEDEC standard
pinouts for x8 memories.
Featuring high performance Byte-Program, the
SST39SF512/010 devices provide a maximum Byte-Pro-
gram time of 30 µsec. These devices use Toggle Bit or
Data# Polling to indicate the completion of Program opera-
tion. To protect against inadvertent write, they have on-chip
hardware and Software Data Protection schemes.
Designed, manufactured, and tested for a wide spectrum of
applications, these devices are offered with a guaranteed
endurance of 10,000 cycles. Data retention is rated at
greater than 100 years.
The SST39SF512/010 devices are suited for applications
that require convenient and economical updating of pro-
gram, configuration, or data memory. For all system appli-
cations, they significantly improve performance and
rweliawbwility.,DwahtilaeSlohweereintg4pUo.wceor mconsumption. They inher-
ently use less energy during erase and program than alter-
native flash technologies. The total energy consumed is a
function of the applied voltage, current, and time of applica-
tion. Since for any given voltage range, the SuperFlash
technology uses less current to program and has a shorter
erase time, the total energy consumed during any Erase or
Program operation is less than alternative flash technolo-
gies. These devices also improve flexibility while lowering
the cost for program, data, and configuration storage appli-
cations.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
To meet high density, surface mount requirements, the
SST39SF512/010 are offered in 32-pin PLCC packages,
32-pin TSOP, and a 600 mil, 32-pin PDIP is also available.
See Figures 1, 2, and 3 for pinouts.
Device Operation
Commands are used to initiate the memory operation func-
tions of the device. Commands are written to the device
using standard microprocessor write sequences. A com-
mand is written by asserting WE# low while keeping CE#
©2001 Silicon Storage Technology, Inc.
S71149-03-000 4/01
394
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.



39SF010
www.DataSheet4U.com
low. The address bus is latched on the falling edge of WE#
or CE#, whichever occurs last. The data bus is latched on
the rising edge of WE# or CE#, whichever occurs first.
Read
The Read operation of the SST39SF512/010 is controlled
by CE# and OE#, both have to be low for the system to
obtain data from the outputs. CE# is used for device selec-
tion. When CE# is high, the chip is deselected and only
standby power is consumed. OE# is the output control and
is used to gate data from the output pins. The data bus is in
high impedance state when either CE# or OE# is high.
Refer to the Read cycle timing diagram for further details
(Figure 4).
Byte-Program Operation
The SST39SF512/010 are programmed on a byte-by-byte
basis. The Program operation consists of three steps. The
first step is the three-byte-load sequence for Software Data
Protection. The second step is to load byte address and
byte data. During the Byte-Program operation, the
addresses are latched on the falling edge of either CE# or
WE#, whichever occurs last. The data is latched on the ris-
ing edge of either CE# or WE#, whichever occurs first. The
third step is the internal Program operation which is initi-
ated after the rising edge of the fourth WE# or CE#, which-
ever occurs first. The Program operation, once initiated, will
be completed, within 30 µs. See Figures 5 and 6 for WE#
and CE# controlled Program operation timing diagrams
and Figure 15 for flowcharts. During the Program opera-
tion, the only valid reads are Data# Polling and Toggle Bit.
During the internal Program operation, the host is free to
perform additional tasks. Any commands written during the
internal Program operation will be ignored.
Sector-Erase Operation
The Sector-Erase operation allows the system to erase the
device on a sector-by-sector basis. The sector architecture
is based on uniform sector size of 4 KByte. The Sector-
Erase operation is initiated by executing a six-byte-com-
mand load sequence for Software Data Protection with
Sector-Erase command (30H) and sector address (SA) in
the last bus cycle. The sector address is latched on the fall-
ing edge of the sixth WE# pulse, while the command (30H)
is latched on the rising edge of the sixth WE# pulse. The
internal Erase operation begins after the sixth WE# pulse.
The end of Erase can be determined using either Data#
Pwwoalvwlienfwgor.moDrsa.TotAagngSylehcBeoimet tmm4aeUnthd.oscdosw.mriStteeen
Figure
during
9 for timing
the Sector-
Erase operation will be ignored.
512 Kbit / 1 Mbit Multi-Purpose Flash
SST39SF512 / SST39SF010
Data Sheet
Chip-Erase Operation
The SST39SF512/010 provide Chip-Erase operation,
which allows the user to erase the entire memory array to
the 1sstate. This is useful when the entire device must be
quickly erased.
The Chip-Erase operation is initiated by executing a six-
byte Software Data Protection command sequence with
Chip-Erase command (10H) with address 5555H in the last
byte sequence. The Erase operation begins with the rising
edge of the sixth WE# or CE#, whichever occurs first. Dur-
ing the Erase operation, the only valid read is Toggle Bit or
Data# Polling. See Table 4 for the command sequence,
Figure 10 for timing diagram, and Figure 18 for the flow-
chart. Any commands written during the Chip-Erase opera-
tion will be ignored.
Write Operation Status Detection
The SST39SF512/010 provide two software means to
detect the completion of a Write (Program or Erase) cycle,
in order to optimize the system Write cycle time. The soft-
ware detection includes two status bits: Data# Polling
(DQ7) and Toggle Bit (DQ6). The End-of-Write detection
mode is enabled after the rising edge of WE#, which ini-
tiates the program or erase cycle.
The actual completion of the nonvolatile write is asynchro-
nous with the system; therefore, either a Data# Polling or
Toggle Bit read may be simultaneous with the completion
of the Write cycle. If this occurs, the system may possibly
get an erroneous result, i.e., valid data may appear to con-
flict with either DQ7 or DQ6. In order to prevent spurious
rejection, if an erroneous result occurs, the software routine
should include a loop to read the accessed location an
additional two (2) times. If both reads are valid, then the
device has completed the Write cycle, otherwise the rejec-
tion is valid.
Data# Polling (DQ7)
When the SST39SF512/010 are in the internal Program
operation, any attempt to read DQ7 will produce the com-
plement of the true data. Once the Program operation is
completed, DQ7 will produce true data. The device is then
ready for the next operation. During internal Erase opera-
tion, any attempt to read DQ7 will produce a 0. Once the
internal Erase operation is completed, DQ7 will produce a
1. The Data# Polling is valid after the rising edge of fourth
WE# (or CE#) pulse for Program Operation. For sector or
Chip-Erase, the Data# Polling is valid after the rising edge
of sixth WE# (or CE#) pulse. See Figure 7 for Data# Polling
timing diagram and Figure 16 for a flowchart.
©2001 Silicon Storage Technology, Inc.
2
S71149-03-000 4/01 394





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)