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M6MGB331S4BKT

Renesas

CMOS SRAM

www.DataSheet4U.com Preliminary Notice: This is not a final specification. Some parametric limits are subject to change...


Renesas

M6MGB331S4BKT

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www.DataSheet4U.com Preliminary Notice: This is not a final specification. Some parametric limits are subject to change. Renesas LSIs M6MGB/T331S4BKT 33,554,432-BIT (2,097,152 - WORD BY 16-BIT/4,194,304-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT (262,144-WORD BY 16-BIT/524,288-WORD BY 8-BIT) CMOS SRAM Stacked - µ MCP (micro Multi Chip Package) Description The M6MGB/T331S4BKT is a Stacked micro Multi Chip Package (S- µMCP) that contents 32M-bit Flash memory and 4M-bit Static RAM in a 52-pin TSOP for lead free use. 32M-bit Flash memory is a 4,194,304 bytes / 2,097,152 words, Features 3.3V-only, and high performance non-volatile memory fabricated by CMOS technology for the peripheral circuit and Access Time DINOR (Divided bit-line NOR) architecture for the memory cell. 4M-bit SRAM is a 524,288 bytes / 262,144 words asynchronous SRAM fabricated by silicon-gate CMOS technology. M6MGB/T331S4BKT is suitable for the application of the mobile-communication-system to reduce both the mount space and weight. M6MGB/T331S4BKT provides for Software Lock Release function. Usually, all memory blocks are locked and can not be programmed or erased, when F-WP# is low. Using Software Lock Release function, program or erase operation can be executed. Flash SRAM 70ns (Max.) 70ns (Max.) VCC=2.7 ~ 3.0V Ta=-40 ~ 85 °C 52pin TSOP(Type-II), Lead pitch 0.4mm Outer-lead finishing:Sn-Cu Supply Voltage Ambient Temperature Package Application Mobile communication products PIN CONFI...




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