KS57P2316

www.DataSheet4U.com BONDING DIAGRAM PRODUCT KS57P2316 PAGE REV NO. 1 80 75 70 65 61 5 60 10 55 Y = 4460um ID : -1552 -1997 X = 3620um 15 www.DataSheet4U.com CJ7235X 50 20 21 25 30 35 40 41 45 TITLE L/F MAT’L CHIP SIZE BACK METAL ALLOY42 3620x4460um BARE_Si CJ7235X #1 PKG TYPE DEV NAME LF PAD SIZE 80_QFP_1420C CJ7235X_Rev0_1420C 283x283 MIL S A M S U N G DOC. # : RK8011-05-03(1/2) www.DataSheet4U www.DataSheet4U.com 4U.com DataSheet 4 U .com THIS DRAWING CONTAINS CONFIDENTIAL INFORMATION PROPRIETARY TO SEC. www.DataSheet4U.com IT MUST NOT BE REPRODUCED OR DISCLOSED TO OTHERS OR USED IN ANY OTHER WAY IN WHOLE OR PART EXCEPT AS AUTHORIZED IN WRITING BY SEC. REV. DATE ECN# 1 80 75 70 65 61 5 60 10 55 Y = 4460um ID : -1552 -1997 X = 3620um 15 50 CJ7235X www.DataSheet4U.com 20 21 25 30 35 40 41 45 PKG TYPE L/F MAT’L CHIP SIZE BACK METAL DESIGN 80_QFP_1420C ALLOY42 3620x4460um BARE_Si CHECKED D/A METHOD WIRE DIA. L/F PAD SIZE MATRIX(CODE) AG_EPOXY #1 1.2MIL 283x283 MIL 1X8 (WM) TITLE CHECKED APPROVED CJ7235X_Rev0_1420C BONDING DIAGRAM TOLERANCE SCALE . . . . . . . . UNIT DWG NO. SPEC NO. 11.96/1 SHEET ELECTRONICS DataSheet 4 U .com www.DataSheet4U www.DataSheet4U.com 4U.com www.DataSheet4U.com PIN ASSIGNMENT PRODUCT KS57P2316 PAGE REV NO. SEG[10] SEG[11] SEG[12] SEG[13] SEG[14] SEG[15] SEG[16] SEG[17] 66 80 79 78 77 76 75 74 73 72 71 70 69 68 67 65 SEG[18] SEG[3] SEG[4] SEG[5] SEG[6] SE...