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K2700 Dataheets PDF



Part Number K2700
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description 2SK2700
Datasheet K2700 DatasheetK2700 Datasheet (PDF)

2SK2700 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π–MOSIII) 2SK2700 Chopper Regulator, DC–DC Converter and Motor Drive Applications z Low drain–source ON resistance z High forward transfer admittance z Low leakage current z Enhancement mode : RDS (ON) = 3.7 Ω (typ.) Unit: mm : |Yfs| = 2.6 S (typ.) : IDSS = 100 μA (max) (VDS = 720 V) : Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristics Drain–source voltage Drain–gate voltage (RGS =.

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2SK2700 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π–MOSIII) 2SK2700 Chopper Regulator, DC–DC Converter and Motor Drive Applications z Low drain–source ON resistance z High forward transfer admittance z Low leakage current z Enhancement mode : RDS (ON) = 3.7 Ω (typ.) Unit: mm : |Yfs| = 2.6 S (typ.) : IDSS = 100 μA (max) (VDS = 720 V) : Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristics Drain–source voltage Drain–gate voltage (RGS = 20 kΩ) Gate–source voltage Drain current DC (Note 1) Symbol VDSS VDGR VGSS ID IDP PD EAS IAR EAR Tch Tstg Rating 900 900 ±30 3 9 40 295 3 http://www.DataSheet4U.net/ Unit V V V A A W mJ A mJ °C °C Pulse (Note 1) Drain power dissipation (Tc = 25°C) Single pulse avalanche energy (Note 2) Avalanche current Repetitive avalanche energy (Note 3) Channel temperature Storage temperature range JEDEC JEITA TOSHIBA ― SC-67 2-10R1B 4 150 −55 to 150 Weight: 1.9 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Thermal resistance, channel to case Thermal resistance, channel to ambient Symbol Rth (ch–c) Rth (ch–a) Max 3.125 62.5 Unit °C / W °C / W Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: VDD = 90 V, Tch = 25°C (initial), L = 60.0 mH, RG = 25 Ω, IAR = 3 A Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2009-09-29 datasheet pdf - http://www.DataSheet4U.net/ 2SK2700 Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Gate–source breakdown voltage Drain cut–off current Drain–source breakdown voltage Gate threshold voltage Drain–source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Symbol IGSS V (BR) GSS IDSS V (BR) DSS Vth RDS (ON) |Yfs| Ciss Crss Coss tr ton tf toff Qg Qgs Qgd VDD ≈ 400 V, VGS = 10 V, ID = 3 A http://www.DataSheet4U.net/ Test Condition VGS = ±30 V, VDS = 0 V IG = ±10 μA, VDS = 0 V VDS = 720 V, VGS = 0 V ID = 10 mA, VGS = 0 V VDS = 10 V, ID = 1 mA VGS = 10 V, ID = 1.5 A VDS = 20 V, ID = 1.5 A Min — ±30 — 900 2.0 — 0.65 — Typ. — — — — — 3.7 2.6 750 10 70 15 Max ±10 — 100 — 4.0 4.3 — — — — — Unit μA V μA V V Ω S VDS = 25 V, VGS = 0 V, f = 1 MHz — — — pF Turn–on time Switching time Fall time — 55 — ns — 30 — Turn–off time Total gate charge (gate–source plus gate–drain) Gate–source charge Gate–drain (“miller”) Charge — — — — 110 25 13 12 — — — — nC Source–Drain Ratings and Characteristics (Ta = 25°C) Characteristics Continuous drain reverse current (Note 1) Pulse drain reverse current (Note 1) Forward voltage (diode) Reverse recovery time Reverse recovery charge Symbol IDR IDRP VDSF trr Qrr IDR = 3 A, VGS = 0 V IDR = 3 A, VGS = 0 V dIDR / dt = 100 A / μs Test Condition — — Min — — — — — Typ. — — — 1100 7.2 Max 3 9 −1.9 — — Unit A A V ns μC Marking Note 4: A line under a Lot No. identifies the indication of product Labels. Not underlined: [[Pb]]/INCLUDES > MCV Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Part No. (or abbreviation code) Lot No. K2700 Note 4 Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2 2009-09-29 datasheet pdf - http://www.DataSheet4U.net/ 2SK2700 http://www.DataSheet4U.net/ 3 2009-09-29 datasheet pdf - http://www.DataSheet4U.net/ 2SK2700 http://www.DataSheet4U.net/ 4 2009-09-29 datasheet pdf - http://www.DataSheet4U.net/ 2SK2700 http://www.DataSheet4U.net/ RG = 25 Ω VDD = 90 V, L = 60 mH EAS = B VDSS 1 ⎛ ⎞ ⋅ L ⋅ I2 ⋅ ⎜ ⎟ − B V 2 DD ⎠ ⎝ VDSS 5 2009-09-29 datasheet pdf - http://www.DataSheet4U.net/ 2SK2700 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is.


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