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UPD780204A Dataheets PDF



Part Number UPD780204A
Manufacturers NEC
Logo NEC
Description (UPD78020x) 8-Bit Single-Chip Microcontrollers
Datasheet UPD780204A DatasheetUPD780204A Datasheet (PDF)

User’s Manual µPD780208 Subseries 8-Bit Single-Chip Microcontrollers µPD780204 µPD780204A µPD780205 µPD780205A µPD780206 µPD780208 µPD78P0208 Document No. U11302EJ4V0UM00 (4th edition) Date Published July 2003 N CP(K) c Printed in Japan [MEMO] 2 User’s Manual U11302EJ4V0UM NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps mu.

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User’s Manual µPD780208 Subseries 8-Bit Single-Chip Microcontrollers µPD780204 µPD780204A µPD780205 µPD780205A µPD780206 µPD780208 µPD78P0208 Document No. U11302EJ4V0UM00 (4th edition) Date Published July 2003 N CP(K) c Printed in Japan [MEMO] 2 User’s Manual U11302EJ4V0UM NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. FIP and IEBus are trademarks of NEC Electronics Corporation. MS-DOS, Windows, and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. IBM DOS, PC/AT, and PC DOS are trademarks of International Business Machines Corporation. HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. TRON stands for The Realtime Operating system Nucleus. ITRON is an .


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