P-Channel E nhancement Mode MOS FET
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S outh S ea S emiconductor
SSS
ID
-8A
S S M4435
J ULY ,2004 V er1.1
P -C hannel E nhancement Mod...
Description
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S outh S ea S emiconductor
SSS
ID
-8A
S S M4435
J ULY ,2004 V er1.1
P -C hannel E nhancement Mode MOS FE T
P R ODUC T S UMMAR Y
V DS S
-30V
F E AT UR E S
( m W ) Max
5
R DS (ON)
S uper high dense cell design for low R DS (ON ).
20 @ V G S = -10V 35 @ V G S = -4.5V
R ugged and reliable. S urface Mount P ackage.
D
8
D
7
D
6
D
5
S O-8 1
1 2 3 4
S
S
S
G
ABS OLUTE MAXIMUM R ATINGS (T A=25 C unless otherwise noted)
P arameter Drain-S ource Voltage Gate-S ource Voltage Drain C urrent-C ontinuous a @ T J =125 C b -P ulsed Drain-S ource Diode Forward C urrent a Maximum P ower Dissipation a Operating Junction and S torage Temperature R ange S ymbol V DS V GS ID IDM IS PD T J , T S TG Limit 30 25 -8 -40 -1.7 2.5 -55 to 150 Unit V V A A A W C
THE R MAL C HAR AC TE R IS TIC S
Thermal R esistance, Junction-to-Ambient a R JA 50 C /W
1
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S S M4435
E LE CTR ICAL CHAR ACTE R IS TICS (T A =25 C unless otherwise noted)
Parameter
5
S ymbol
BV DS S IDS S IGS S V GS (th) R DS (ON) ID(ON) gFS C IS S C OS S CRSS
c
Condition
V GS = 0V, ID = -250uA V DS = -24V, V GS = 0V V GS = 25V, V DS = 0V V DS = V GS , ID = -250uA V GS = -10V, ID = -8.0A V GS = -4.5V, ID = -5.0A V DS = -5V, V GS = -10V V DS = -15V, ID = - 8.0A
Min Typ C Max Unit
-30 -1 100 -1 -1.6 15 22 -20 6 1199 362 137 -3 V uA nA V
OFF CHAR ACTE R IS TICS
Drain-S ource Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage
ON CHAR ACTE R IS TICS b
...
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