QFP-SD

www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack Stacking of die enables more functionality and integration in a conventional QFP package FEATURES Combining devices into one package reduces PCB real estate and cost Increased sub-system performance by integrating multiple chips into a single package Die to die bonding capability for device/signal integration Standard and green/lead-free materials and Pb-free plating Options for mixed technologies, 2 or more stacked dice Fine pitch bonding capability Exposed pad provides enhanced thermal performance Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD) Lead pitch ranges from 0.80mm to 0.40mm Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD) JEDEC standard compliant package outlines DESCRIPTION STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance. STATS ChipPAC’s chip stacking technology allows the integration of multiple ICs within a single package to improve package performance and functionality while reducing overall package size and cost. The die to die wire bonding capability enables device/signal integration to improve electrical performance and reduce overall package I...