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LL2705 Dataheets PDF



Part Number LL2705
Manufacturers International Rectifier
Logo International Rectifier
Description IRLL2705
Datasheet LL2705 DatasheetLL2705 Datasheet (PDF)

www.DataSheet.co.kr PD- 91380B IRLL2705 HEXFET® Power MOSFET Surface Mount Dynamic dv/dt Rating l Logic-Level Gate Drive l Fast Switching l Ease of Paralleling l Advanced Process Technology l Ultra Low On-Resistance Description l l D VDSS = 55V RDS(on) = 0.04Ω G ID = 3.8A S Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized .

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www.DataSheet.co.kr PD- 91380B IRLL2705 HEXFET® Power MOSFET Surface Mount Dynamic dv/dt Rating l Logic-Level Gate Drive l Fast Switching l Ease of Paralleling l Advanced Process Technology l Ultra Low On-Resistance Description l l D VDSS = 55V RDS(on) = 0.04Ω G ID = 3.8A S Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pickand-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application S O T -22 3 Absolute Maximum Ratings Parameter ID @ TA = 25°C ID @ TA = 25°C ID @ TA = 70°C IDM PD @TA = 25°C PD @TA = 25°C VGS EAS IAR EAR dv/dt TJ, TSTG Continuous Drain Current, VGS @ 10V** Continuous Drain Current, VGS @ 10V* Continuous Drain Current, VGS @ 10V* Pulsed Drain Current  Power Dissipation (PCB Mount)** Power Dissipation (PCB Mount)* Linear Derating Factor (PCB Mount)* Gate-to-Source Voltage Single Pulse Avalanche Energy‚ Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt ƒ Junction and Storage Temperature Range Max. 5.2 3.8 3.0 30 2.1 1.0 8.3 ± 16 110 3.8 0.10 7.5 -55 to + 150 Units A W W mW/°C V mJ A mJ V/ns °C Thermal Resistance Parameter RθJA RθJA Junction-to-Amb. (PCB Mount, steady state)* Junction-to-Amb. (PCB Mount, steady state)** Typ. 93 48 Max. 120 60 Units °C/W * When mounted on FR-4 board using minimum recommended footprint. ** When mounted on 1 inch square copper board, for comparison with other SMD devices. www.irf.com 1 1/22/99 Datasheet pdf - http://www.DataSheet4U.net/ www.DataSheet.co.kr IRLL2705 Electrical Characteristics @ TJ = 25°C (unless otherwise specified) V(BR)DSS ∆V(BR)DSS/∆TJ Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Min. 55 ––– ––– ––– ––– 1.0 5.1 ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– Typ. Max. Units Conditions ––– ––– V V GS = 0V, ID = 250µA 0.061 ––– V/°C Reference to 25°C, ID = 1mA ––– 0.040 VGS = 10V, ID = 3.8A „ ––– 0.051 Ω VGS = 5.0V, ID = 3.8A „ ––– 0.065 VGS = 4.0V, ID = 1.9A „ ––– 2.0 V VDS = V GS, ID = 250µA ––– ––– S V DS = 25V, ID = 1.9A ––– 25 VDS = 55V, VGS = 0V µA ––– 250 VDS = 44V, VGS = 0V, TJ = 150°C ––– 100 VGS = 16V nA ––– -100 VGS = -16V 32 48 ID = 3.8A 3.5 5.3 nC VDS = 44V 9.7 14 VGS = 10V, See Fig. 6 and 9 „ 6.2 ––– VDD = 28V 12 ––– ID = 3.8A ns 35 ––– RG = 6.2Ω 22 ––– RD = 7.1Ω, See Fig. 10 „ 870 ––– VGS = 0V 220 ––– pF VDS = 25V 92 ––– ƒ = 1.0MHz, See Fig. 5 Source-Drain Ratings and Characteristics IS ISM VSD trr Qrr ton Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode)  Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time Min. Typ. Max. Units Conditions MOSFET symbol ––– ––– 0.91 showing the A integral reverse ––– ––– 30 p-n junction diode. ––– ––– 1.3 V TJ = 25°C, IS = 3.8A, VGS = 0V „ ––– 58 88 ns TJ = 25°C, I F = 3.8A ––– 140 210 nC di/dt = 100A/µs „ Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes:  Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) ƒ ISD ≤ 3.8A, di/dt ≤ 220A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C ‚ VDD = 25V, starting TJ = 25°C, L = 15mH RG = 25Ω, I AS = 3.8A. (See Figure 12) „ Pulse width ≤ 300µs; duty cycle ≤ 2%. 2 www.irf.com Datasheet pdf - http://www.DataSheet4U.net/ www.DataSheet.co.kr IRLL2705 100 TOP VGS 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V BOTTOM 3.0V 100 I D , D rain-to-Source C urrent (A) 10 I D, D rain-to-S ource C u rrent (A) VGS 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V BOTTOM 3.0V TOP 10 3 .0V 3 .0 V 1 0.1 1 2 0µ s P U L S E W ID T H TJ = 25 °C A 10 100 1 0.1 1 2 0µ s P U L S E W ID TH TJ = 15 0°C A 10 100 V DS , D rain-to-S ource V oltage (V ) V D S , D rain-to-S ource V oltage (V ) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 100 2.0 R D S (on) , D ra in-to -S o urc e O n R e s is ta nc e (N o rm alize d) I D = 3.8 A I D , D rain-to-So urce C .


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