Thick Film Molded SIPs
www.DataSheet4U.com
Ro VER LEA H S SI D F CO ON RE M SA E PL R IA E NT
Features
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Lead free versions available ...
Description
www.DataSheet4U.com
Ro VER LEA H S SI D F CO ON RE M SA E PL R IA E NT
Features
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Lead free versions available (see How to Order “Termination” option) RoHS compliant (lead free version)* Low profile provides compatibility with DIPs Also available in medium profile (4300S .250 ”) and high profile (4300K - .350 ”)
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Marking on contrasting background Custom circuits available per factory
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics Resistance Range Bussed ...................49.9 to 100K ohms Isolated ......................20 to 200K ohms Series.........................20 to 100K ohms Resistance Tolerance .........................±0.1 %, ±0.5 %, ±1 % Temperature Coefficient ..................±100 ppm/°C, ±50 ppm/°C, ±25 ppm/°C Temperature Range ....-55 °C to +125 °C Insulation Resistance ..................10,000 megohms minimum TCR Tracking .........................±5 ppm/°C Maximum Operating Voltage............50 V Environmental Characteristics Thermal Shock and Power Conditioning ...................... 0.1 % Short Time Overload ..................... 0.1 % Terminal Strength ........................ 0.25 % Resistance to Soldering Heat ....... 0.1 % Moisture Resistance ..................... 0.1 % Life .............................................. 0.50 % Physical Characteristics Body Material Flammability ...........................Conforms to UL94V-0 Lead Frame Material ..........................Copper, solder coated Body Material .................
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