ZMD31010

www.DataSheet4U.com ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY ZMD31010 RBicLite™ Technical Notes Die Dimensions and Pad Coordinates Contents 1 2 3 RBICLITE™ DIE DIMENSIONS..................................................................................................................... 2 RBICLITE™ PAD COORDINATES ............................................................................................................... 3 RELATED DOCUMENTS............................................................................................................................ 4 Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 1 of 4 © ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY 1 RBicLite™ Die Dimensions Die size (including scribeline): 2230 µm x 1681 µm ≈ 3.75sqmm Core die size (without scribeline): Die thickness: 390µm Scribeline (distance between two core dice on wafer): 150µm Pads size: 68µm x 68µm 2080 µm x 1531 µm ≈ 3.19 sqmm Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0...