WF1M32B-XXX3

www.DataSheet4U.com White Electronic Designs 1Mx32 3.3V Flash Module FEATURES Access Times of 100, 120, 150ns ■ Packaging 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401) 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180") square (Package 509) ■ ■ 1,000,000 Erase/Program Cycles Sector Architecture One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes in byte mode Any combination of sectors can be concurrently erased. Also supports full chip erase ■ ■ ■ Organized as 1Mx32 Commercial, Industrial and Military Temperature Ranges 3.3 Volt for Read and Write Operations ■ ■ ■ ■ ■ ■ ■ WF1M32B-XXX3 Boot Code Sector Architecture (Bottom) Low Power CMOS, 1.0mA Standby Embedded Erase and Program Algorithms Built-in Decoupling Caps for Low Noise Operation Erase Suspend/Resume Supports reading data from or programing data to a sector not being erased Low Current Consumption Typical values at 5MHz: 40mA Active Read Current 80mA Program/Erase Current Weight WF1M32B-XG2TX3 -8 grams typical WF1M32B-XHX3 -13 grams typical Note: For programming information refer to Flash Programming 8M3 Application Note. PIN CONFIGURATION FOR WF1M32B-XHX3 Top View 1 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 11 22 12 RESET# Pin Description I/O0-31 A0-19 Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Reset Power Supply Ground Not Connected 23 I/O15 I/O14 I/O13 I/O12 OE# A17 WE# I/O7 I/O6 I/O5 I/O4 33 I/O24 I/O25 I/O26 A7 A12 NC A13 A8 I/O1...