SSOP28

www.DataSheet4U.com Package information - SSOP28 Surface mounted, 28 pin package Package outline D ␪ E1 E L c A2 A e A1 b Dim. A A1 A2 D E E1 Millimeters Min. 1.70 0.05 1.65 9.90 7.40 5.00 Max. 2.00 0.15 1.85 10.50 8.20 5.60 Inches Min. 0.067 0.002 0.065 0.390 0.291 0.197 Max. 0.079 0.006 0.073 0.413 0.323 0.220 Dim. L e b c ⍜ - Millimeters Min. 0.55 0.22 0.09 0° Max. 0.95 0.38 0.25 8° - Inches Max. 0.022 0.009 0.004 0° Max. 0.037 0.015 0.010 8° - 0.65 BSC 0.026 BSC Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Soldering footprint 2.261 0.089 9.017 0.355 4.597 0.181 0.432 0.017 0.650 0.0256 mm inches Issue 1 - September 2005 © Zetex Semiconductors plc 2005 1 www.zetex.com Package information - SSOP28 Embossed carrier tape configuration P0 K t Top cover tape 10 pitches culmulative tolerance on tape ±0.2mm (±0.008”) D P2 E See Note 1 A0 See Note 1 F W B1 K0 See Note 1 B0 P Embossment Center lines of cavity D1 User direction of feed Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P Tape size (mm) 8 See note* 4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 ± 0.10 3.50 ± 0.10 (0.138 ± 0.004) 4.00 ±0.10 (0.157 ± 0.004) 12 See note* 8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 5.50 ± 0.05 (0.217 ± 0.002) 4.00 ±0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 16 See note* 12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 7.50 ± 0.10 (0.295 ± 0.004) 4.00 ± 0.10 (0.157 ± ...