WF512K32-xxx5

www.DataSheet4U.com WF512K32-XXX5 HI-RELIABILITY PRODUCT 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES s Access Times of 60, 70, 90, 120, 150ns s Packaging 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400 (1)) 68 lead, 40mm, Low Capacitance Hermetic CQFP (Package 501) 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP (Package 502) 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U), 3.5mm (0.140") high, (Package 510) 68 lead, 23.9mm (0.940") Low Profile CQFP (G1U), 3.5mm (0.140") high, (Package 519) s 100,000 Erase/Program Cycles Minimum s Sector Architecture 8 equal size sectors of 64KBytes each Any combination of sectors can be concurrently erased. Also supports full chip erase s Organized as 512Kx32 s Commercial, Industrial and Military Temperature Ranges s 5 Volt Programming. 5V ± 10% Supply. s Low Power CMOS, 6.5mA Standby s Embedded Erase and Program Algorithms s TTL Compatible Inputs and CMOS Outputs s Built-in Decoupling Caps for Low Noise Operation s Page Program Operation and Internal Program Control Time s Weight WF512K32-XG2UX5 - 8 grams typical WF512K32-XH1X5 - 13 grams typical WF512K32-XG4X5 - 20 grams typical WF512K32-XG4TX5 - 20 grams typical WF512K32-XG1UX5 - 5 grams typical 1. Call factory for PGA type (HIP) package options. Note: See Flash Programming Application Note 4M5 for algorithms. FIG. 1 1 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 11 PIN CONFIGURATION FOR WF512K32N-XH1X5 TOP VIEW 12 WE2 CS2 GND I/O11 A10 A9 A1...