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EMIF06-1502M12 Dataheets PDF



Part Number EMIF06-1502M12
Manufacturers ST Microelectronics
Logo ST Microelectronics
Description 6 line low capacitance EMI filter and ESD protection
Datasheet EMIF06-1502M12 DatasheetEMIF06-1502M12 Datasheet (PDF)

www.DataSheet4U.com EMIF06-1502M12 IPAD™ 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics Where EMI filtering in ESD sensitive equipment is required: ■ ■ ■ ■ 12 11 10 9 8 7 GND GND 1 2 3 4 5 6 LCD & CAMERA for Mobile phones Computers and printers Communication systems MCU Boards Micro QFN 2.5 mm x 1.5 mm (bottom view) Description The EMIF06-1502M12 is a 6 line highly integrated device designed to suppress EMI/RFI noise in all systems e.

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www.DataSheet4U.com EMIF06-1502M12 IPAD™ 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics Where EMI filtering in ESD sensitive equipment is required: ■ ■ ■ ■ 12 11 10 9 8 7 GND GND 1 2 3 4 5 6 LCD & CAMERA for Mobile phones Computers and printers Communication systems MCU Boards Micro QFN 2.5 mm x 1.5 mm (bottom view) Description The EMIF06-1502M12 is a 6 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the input pins. Pin configuration (top view) 1 Input 2 Input 3 Input 4 Input Output 12 Output 11 Output 10 Output 9 Output 8 Output 7 Benefits ■ ■ ■ ■ ■ ■ ■ ■ 5 Input 6 Input EMI asymmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 2.5 mm x 1.5 mm Very thin package: 0.6 mm max High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4). High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging. Lead free package Basic cell configuration Input 170 Ω Output Typical line capacitance = 14 pF @ 2.5 V Complies with following standards: IEC 61000-4-2 level 4 input pins 15kV (air discharge) 8kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 (all pins) Order code Part number EMIF06-1502M12 Marking E TM: IPAD is a trademark of STMicroelectronics July 2006 Rev 2 www.st.com 1/9 Characteristics EMIF06-1502M12 1 Table 1. Symbol VPP Tj Top Tstg Characteristics Absolute ratings (limiting values at Tamb = 25° C unless otherwise specified) Parameter ESD discharge IEC 61000-4-2 air discharge on input pins ESD discharge IEC 61000-4-2 contact discharge on input pins Junction temperature Operating temperature range Storage temperature range Value 15 8 125 -40 to + 85 -55 to +150 Unit kV °C °C °C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Electrical characteristics (Tamb = 25° C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic resistance Peak pulse current Series resistance between Input & Output Input capacitance per line IPP VBR VCL VRM IRM IR VF V I IF Symbol VBR IRM RI/O Cline IR = 1 mA VRM = 3 V per line Tolerance ± 10% Test conditions Min. 6 Typ. 8 Max. 10 100 Unit V nA Ω pF 153 170 14 187 VR= 2.5 V DC, VOSC = 30 mV, F = 1 MHz Figure 1. 0.00 S21(dB) attenuation measurement dB Figure 2. dB 0.00 -10.00 -20.00 Analog cross talk measurements -15.00 -30.00 -40.00 -50.00 -60.00 -30.00 -70.00 -80.00 F (Hz) -45.00 100.0k 1.0M 10.0M 100.0M 1.0G -90.00 -100.00 100.0k F (Hz) 1.0M 10.0M 100.0M 1.0G 2/9 EMIF06-1502M12 Ordering information scheme Figure 3. ESD response to IEC 61000-4-2 Figure 4. (+15 kV air discharge) on one input (Vin) and on one output (Vout) Vin ESD response to IEC 61000-4-2 (- 15 kV air discharge) on one input (Vin) and on one output (Vout) C1 = 10 V/d C1 = 10 V/d Vin Vout C2 = 5 V/d C2 = 5 V/d Vout 100 ns/d 100 ns/d Figure 5. Line capacitance versus reverse voltage applied (typical value) CLINE(pF) 24 22 20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 VLINE(V) 2.5 3.0 3.5 4.0 4.5 5.0 2 Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) Package Mx = Micro QFN x leads yy - xxx z Mx 3/9 Package information EMIF06-1502M12 3 Package information Table 3. QFN 2.5 x 1.5 package dimensions Dimensions Ref Millimeters MIN A A1 b D D2 E E2 e k L 0.20 0.25 0.30 0.35 0.30 1.70 0.50 0.00 0.15 TYP 0.55 0.02 0.18 2.50 1.80 1.50 0.40 0.40 0.08 0.10 0.12 0.14 0.50 0.12 1.90 0.67 MAX 0.60 0.05 0.25 MIN 0.20 0.00 0.06 inches TYP 0.22 0.01 0.07 0.98 0.71 0.59 0.16 0.16 0.24 0.75 MAX 0.24 0.02 0.10 Figure 6. Footprint Figure 7. Marking Dot: Pin 1 Identification X = Marking YWW= Data code (Y=year WW= week XY ww 4/9 EMIF06-1502M12 Figure 8. Tape and reel specification 2.0+/-0.05 4.00+/-0.1 f 1.5 +/- 0.1 Package information 1.75 +/- 0.1 3.5 +/- 0.05 0.75 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8.1 +/- 0.1 XY ww XY ww XY ww 2.70 1.70 User direction of unreeling 4.00 5/9 Recommendation on PCB assembly EMIF06-1502M12 4 4.1 Recommendation on PCB assembly Stencil opening design 1. General recommendation on stencil opening design a) Stencil Opening Dimensions: L (Length), W (Width), T (Thickness). L T W b) General D.


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