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HT36B2 Dataheets PDF



Part Number HT36B2
Manufacturers Holtek Semiconductor
Logo Holtek Semiconductor
Description 8-Bit Music Synthesizer MCU
Datasheet HT36B2 DatasheetHT36B2 Datasheet (PDF)

www.DataSheet4U.com HT36B2 8-Bit Music Synthesizer MCU Features · Operating voltage: 3.6V~5.0V · Operating frequency: 3.58MHz~12MHz · Sampling rate of 44.1kHz as 11.059MHz for system frequency · Eight-level subroutine nesting · HALT function and wake-up feature to reduce power (typ. 11.059MHz) · 32 bidirectional I/O lines · Two 16-bit programmable timer/event counters with consumption · Bit manipulation instructions · 16-bit table read instructions · 63 powerful instructions · All instructio.

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www.DataSheet4U.com HT36B2 8-Bit Music Synthesizer MCU Features · Operating voltage: 3.6V~5.0V · Operating frequency: 3.58MHz~12MHz · Sampling rate of 44.1kHz as 11.059MHz for system frequency · Eight-level subroutine nesting · HALT function and wake-up feature to reduce power (typ. 11.059MHz) · 32 bidirectional I/O lines · Two 16-bit programmable timer/event counters with consumption · Bit manipulation instructions · 16-bit table read instructions · 63 powerful instructions · All instructions in 1 or 2 machine cycles · 28-pin SOP, 56-pin SSOP package overflow interrupts · Watchdog Timer · Built-in 8-bit MCU with 576´8 bits RAM · Built-in 128K´16-bit ROM for program/data shared · Two High D/A converter resolution: 16 bits · Polyphonic up to 16 notes · Independent pan and volume mix can be assigned to each sound component General Description The HT36B2 is an 8-bit high performance RISC-like microcontroller specifically designed for music applications. It provides an 8-bit MCU and a 16 channel wavetable synthesizer. The program ROM is composed of both program control codes and wavetable voice codes, and can be easily programmed. The HT36B2 has a built-in 8-bit microprocessor which programs the synthesizer to generate the melody by setting the special register from 20H~2AH. A HALT feature is provided to reduce power consumption. Block Diagram V D V S V D V S S te re o 1 6 - B it D A C D D A S A S P A P B P C P D 0 ~ 0 ~ 0 ~ 0 ~ P A P B P C P D IN O S C O S C T R E S 7 7 7 7 1 2 8 K ´ 1 6 - b it R O M 8 - B it M C U 5 7 6 ´ 8 R A M M u ltip lie r /P h a s e G e n e ra l 1 2 R C H L C H Rev. 1.00 1 July 3, 2003 HT36B2 Pin Assignment V D D R E S P C 7 P C 6 P C 5 P C 4 P C 3 P C 2 N C N C N C N C N C N C V S S 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 1 3 1 4 V D D R E S N C N C N C N C N C N C N C N C P A 7 P A 6 P A 5 2 8 2 7 2 6 2 5 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 O S C 1 O S C 2 V S S A V D D A L C H R C H N C N C IN T P A 0 P A 1 P A 2 P A 3 P A 4 N C N C N C N C N C P C 1 P C 0 P B 7 P B 6 P B 5 P B 4 P B 3 P B 2 P B 1 9 1 0 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 8 7 6 5 4 3 2 1 5 6 5 5 5 4 5 3 5 2 5 1 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 4 0 3 9 3 8 3 7 3 6 3 5 3 4 3 3 3 2 3 1 3 0 2 9 V S S O S C 1 O S C 2 V S S A V D D A L C H R C H P D 0 P D 1 P D 2 P D 3 P D 4 P D 5 P D 6 P D 7 N C N C N C IN T P A 0 P A 1 P A 2 P A 3 P A 4 P A 5 P A 6 P A 7 P B 0 H T 3 6 B 2 2 8 S O P -A H T 3 6 B 2 5 6 S S O P -A Rev. 1.00 2 July 3, 2003 HT36B2 Pad Assignment V D D A O S C 2 O S C 1 V S S A R C H V D D R E S V S S L C H P C 4 4 1 P C 6 P C 5 P C 2 1 2 P C 1 P C 7 P C 3 4 2 3 P C 0 4 0 3 9 3 8 3 7 3 6 3 5 3 4 3 3 3 2 3 1 3 0 2 9 2 8 2 7 2 6 2 5 (0 , 0 ) 2 4 2 3 2 2 2 1 P D 0 P D 1 P D 2 P D 3 P D 4 P D 5 P D 6 P D 7 4 P B 7 5 P B 6 6 P B 5 7 P B 4 8 9 1 0 P B 1 1 1 P B 0 1 2 P A 7 1 3 P A 6 1 4 P A 5 1 5 P A 4 1 6 P A 3 1 7 P A 2 1 8 P A 1 1 9 P A 0 2 0 IN T * The IC substrate should be connected to VSS in the PCB layout artwork. P B 2 P B 3 Chip size: 117.1 ´ 139.8 (mil) Rev. 1.00 3 July 3, 2003 HT36B2 Pad Coordinates Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 X -1327.608 -1321.808 -1221.808 -1111.208 -1011.208 -900.608 -800.608 -690.008 -590.008 -479.408 -379.408 -268.808 -168.808 -58.208 41.792 152.392 252.392 362.992 462.992 571.392 1320.992 Y 1607.250 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -257.280 Pad No. 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 X 1320.992 1320.992 1320.992 1320.992 1320.992 1320.992 1320.992 1324.492 1211.492 1099.052 950.392 833.168 155.316 34.192 -572.908 -694.032 -795.808 -906.408 -1006.408 -1117.008 -1217.008 Y -146.680 -46.680 63.920 163.920 274.520 374.520 485.120 1571.300 1571.300 1571.300 1571.300 1571.200 1571.200 1604.750 1604.750 1607.250 1607.250 1607.250 1607.250 1607.250 1607.250 Unit: mm Pad Description Pad Name PA0~PA7 PB0~PB7 PC0~PC7 PD0~PD7 INT RCH LCH VDDA VSSA OSC1 OSC2 VSS VDD RES I/O I/O I/O I/O I/O I O O ¾ ¾ I O ¾ ¾ I Internal Connection Pull-High or None Pull-High or None Pull-High or None Pull-High or None Pull-High ¾ ¾ ¾ ¾ Function Bidirectional 8-bit Input/Output port, wake-up by mask option Bidirectional 8-bit Input/Output port Bidirectional 8-bit Input/Output port Bidirectional 8-bit Input/Output port External interrupt R channel audio output L channel audio output DAC power supply Negative power supply of DAC, ground OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/8 system clock. The system clock may come from the crystal, the two pins cannot be floating. Negative power supply, ground Positive power supply Reset input, active low ¾ ¾ ¾ ¾ Rev. 1.00 4 July 3,.


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