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BAS40H
General-purpose Schottky diode in small SOD123F package
Rev. 01 — 25 April 2005 Product data sheet
1. Product profile
1.1 General description
General purpose Schottky diode, encapsulated in a SOD123F small and flat lead SMD plastic package.
1.2 Features
s s s s s Small and flat lead SMD plastic package Flat leads: excellent coplanarity and improved thermal behavior Low capacitance High switching speed Low leakage current
1.3 Applications
s Ultra high-speed switching s Voltage clamping
1.4 Quick reference data
Table 1: Symbol IF VF VR
[1]
Quick reference data Parameter forward current forward voltage reverse voltage IF = 10 mA
[1]
Conditions
Min -
Typ -
Max 120 500 40
Unit mA mV V
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Philips Semiconductors
BAS40H
General-purpose Schottky diode in small SOD123F package
2. Pinning information
Table 2: Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
Symbol
1 2
sym001
1
2
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3: Ordering information Package Name BAS40H Description plastic surface mounted package; 2 leads Version SOD123F Type number
4. Marking
Table 4: BAS40H Marking codes Marking code AJ Type number
5. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF IFRM IFSM Ptot Tj Tamb Tstg
[1] [2]
Parameter reverse voltage forward current repetitive peak forward current
Conditions
Min -
Max 40 120 120 200 375 150 +150 +150
Unit V mA mA mA mW °C °C °C
tp ≤ 1 s; δ ≤ 0.5
[1]
−65 −65
non-repetitive peak forward tp ≤ 10 ms current total power dissipation junction temperature ambient temperature storage temperature Tamb ≤ 25 °C
[2]
Tj = 25 °C prior to surge. Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
9397 750 14968
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 25 April 2005
2 of 8
Philips Semiconductors
BAS40H
General-purpose Schottky diode in small SOD123F package
6. Thermal characteristics
Table 6: Symbol Rth(j-a) Rth(j-sp)
[1] [2] [3]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air
[1] [2]
Min -
Typ -
Max 330 70
Unit K/W K/W
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. Soldering point of cathode tab.
7. Characteristics
Table 7: Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF Parameter forward voltage Conditions IF = 1 mA IF = 10 mA IF = 40 mA IR Cd
[1]
[1] [1] [1]
Min -
Typ -
Max 380 500 1 1 10 5
Unit mV mV V µA µA pF
reverse current diode capacitance
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
VR = 30 V VR = 40 V VR = 0 V; f = 1 MHz
9397 750 14968
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 25 April 2005
3 of 8
Philips Semiconductors
BAS40H
General-purpose Schottky diode in small SOD123F package
102
IF (mA)
mlc361
103 IR (µA)
(1)
mlc362
102 10 10
(1) (2) (3) (4) (2)
1 1 10−1
10−1
(3)
10−2
0
0.2
0.4
0.6
0.8
VF (V)
1
10−2 0 10 20 30 VR (V) 40
(1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (4) Tamb = −40 °C
(1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C
Fig 1. Forward current as a function of forward voltage; typical values
103 rdif (Ω) 102
mlc364
Fig 2. Reverse current as a function of junction temperature
mlc363
5 Cd (pF) 4
3
2
10
1
1 10−1
1
10
IF (mA)
102
0 0 10 20 30 VR (V) 40
Tamb = 25 °C; f = 10 kHz
Tamb = 25 °C; f = 1 MHz
Fig 3. Differential forward resistance as a function of forward current; typical values
Fig 4. Diode capacitance as a function of reverse voltage; typical values
9397 750 14968
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 25 April 2005
4 of 8
Philips Semiconductors
BAS40H
General-purpose Schottky diode in small SOD123F package
8. Package outline
1.7 1.5 1 0.55 0.35 3.6 3.4 2.7 2.5 1.2 1.0
2 0.70 0.55 Dimensions in mm 0.25 0.10 04-11-29
Fig 5. Package outline SOD123F
9. Packing information
Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number BAS40H
[1]
Package SOD123F
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
For further information and the availability of packing methods, see Section 15.
10. Soldering
4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×)
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 6. Reflow soldering footprint SOD123F
9397 750 14968
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 25 April 2005
5 of 8
Philips Semiconductors
BAS40H
General-purpose.