LOW PROFILE QUAD FLAT PACKAGE 208 PIN PLASTIC
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FUJITSU SEMICONDUCTOR DATA SHEET
LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE
208 PIN PLASTIC
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Description
www.DataSheet4U.com
FUJITSU SEMICONDUCTOR DATA SHEET
LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE
208 PIN PLASTIC
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FPT-208P-M06
208-pin plastic LQFP Lead pitch Package width × package length Lead shape Sealing method 0.50 mm 28 × 28 mm Gullwing Plastic mold
(FPT-208P-M06)
208-pin plastic LQFP (FPT-208P-M06)
30.00±0.20(1.181±.008)SQ 28.00±0.10(1.102±.004)SQ
156 105
1.70(.067)MAX. (Mounting height) "A"
104
157
0.08(.003)
Details of "A" part 0.25(.010) 1.70(.067)MAX. (Mounting height)
INDEX
208
53
0~8° 0.45/0.75 (.018/.030) 0.10±0.05 (.004±.002) (Stand off)
LEAD No.
1
52
0.50(.0197) TYP
0.22 –0.04 .009 –.002
+0.05 +.002
0.08(.003)
M
0.145 –0.03 .006 –.001
+0.05 +.002
C
1997 FUJITSU LIMITED F208027S-1C-1
Dimensions in mm (inches).
The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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