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XPC823ELE Dataheets PDF



Part Number XPC823ELE
Manufacturers Motorola
Logo Motorola
Description AC Electrical Specifications
Datasheet XPC823ELE DatasheetXPC823ELE Datasheet (PDF)

www.DataSheet4U.com Order this document by MPC823ELE/D Revision 1 MPC823 AC Electrical Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC823. Note: Visit our website at www.motorola.com if you are using a frequency other than 25, 40, or 50MHz. Our website contains a spreadsheet that you can use to calculate the timing for your specific system frequency. This device contains circuitry pro.

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www.DataSheet4U.com Order this document by MPC823ELE/D Revision 1 MPC823 AC Electrical Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC823. Note: Visit our website at www.motorola.com if you are using a frequency other than 25, 40, or 50MHz. Our website contains a spreadsheet that you can use to calculate the timing for your specific system frequency. This device contains circuitry protecting against damage from high-static voltage or electrical fields. However, it is advised that precautions be taken to avoid application of any voltages higher than the maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (either GND or VCC). This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. PowerPC is a registered trademark of IBM Corp. and is used by Motorola under license from IBM Corp. I2C is a registered trademark of Philips Corporation. Ó 2000 Motorola, Inc.All Rights Reserved. www.DataSheet4U.com MAXIMUM RATINGS (GND = 0V) RATING Supply Voltage SYMBOL VDDH VDD KAPWR VDDSYN Input Voltage (JTAG and GPIO) Input Voltage (All other pins) Operating Temperature VIN VIN TA VALUE -0.3 to 4.0 -0.3 to 4.0 -0.3 to 4.0 -0.3 to 4.0 -0.3 to 5.8 -0.3 to 3.3 0 to 70û or -40û to 85û -55 to +150 UNIT V V V V V V ûC Storage Temperature Range NOTES: 1. TSTG ûC Functional operating conditions are given in DC Electrical Characteristics (VCC = 3.0 - 3.6 V). Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage to the device. CAUTION: The JTAG and GPIO input voltages cannot be more than 2.5 V greater than supply voltage, this restriction applies also on Òpower-onÓ as well as on normal operation. 5 Volt friendly inputs are inputs that tolerate 5 volts for JTAG and GPIO pins. If you are using Mask Revision Base #F98S (Revision 0), all pins except EXTAL and CLK4IN are 5V tolerant inputs. 2. 3. 4. THERMAL CHARACTERISTICS CHARACTERISTIC Thermal Resistance for BGA SYMBOL qJc VALUE ~30 UNIT °C/W 2 MPC823 ELECTRICAL SPECIFICATIONS MOTOROLA www.DataSheet4U.com POWER CONSIDERATIONS The average chip-junction temperature, TJ, in °C can be obtained from TJ = TA + (PD ¥ qJA) where TA = qJA = PD = PINT = PI/O = Ambient Temperature, ¥C Package Thermal Resistance, Junction to Ambient, ¥C/W PINT + PI/O IDD x VDD, WattsÑChip Internal Power Power Dissipation on Input and Output PinsÑUser Determined (1) For most applications PI/O < 0.3 ¥ PINT and can be neglected. If PI/O is neglected, an approximate relationship between PD and TJ is: PD = K Õ (TJ + 273¥C) (2) Solving equations (1) and (2) for K gives K= PD ¥ (TA + 273¥C) + qJA ¥ PD 2 (3) where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA. Layout Practices Each VCC pin on the MPC823 should be provided with a low-impedance path to the boardÕs supply. Each GND pin should be provided with a low-impedance path to ground. The power supply pins drive distinct groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 mF bypass capacitors located as close as possible to the four sides of the package. The capacitor leads and associated printed circuit traces connecting to chip VCC and GND should be kept to less than half an inch per capacitor lead. A four-layer board that employs two inner layers as VCC and GND planes should be used. All output pins on the MPC823 have fast rise and fall times. Printed circuit (PC) trace interconnection length should be minimized in order to minimize undershoot and reflections caused by these fast output switching times. This recommendation particularly applies to the address and data busses. Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins. MOTOROLA MPC823 ELECTRICAL SPECIFICATIONS 3 www.DataSheet4U.com DC ELECTRICAL CHARACTERISTICS (VCC = 3.0 - 3.6 V) CHARACTERISTIC Input High Voltage (for JTAG and GPIO) Input High Voltage (all other pins) Input Low Voltage EXTAL and EXTCLK Input High Voltage Input Leaka.


VS6750 XPC823ELE XPC823D


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